WASHINGTON – SEMI announced that global semiconductor equipment billings reached $33.07 billion in the second quarter, representing a 24% year-over-year increase and a 3% quarter-over-quarter gain. The strong results were driven by demand for advanced logic and high-bandwidth memory (HBM) DRAM applications, alongside increased shipments to Asia.
TAIPEI – Hon Hai Precision Industry (Foxconn) posted August sales of NT$606.51 billion, an 11% year-on-year increase YoY. The company’s growth rate for the month stood at 10.6%. Investor sentiment remains positive. Market watchers cite Hon Hai’s expanding role in AI data centers through its alliance with Teco, as well as its growing electric vehicle portfolio, highlighted by Mitsubishi Motors outsourcing EV production to Foxconn.
Inventec is set to establish a presence in Katy, Texas, with renovations beginning this fall on its first US facility in the region. The company has leased approximately 540,000 square feet of space at Park 10 Ninety Nine near Katy Asian Town, signaling a long-term commitment to the area.
TEMPE, AR – Benchmark Electronics has announced a leadership transition with president and chief xecutive officer Jeff Benck set to retire on March 31. Benck, who has led the company since 2019, will continue as an advisor until March 2027 to ensure a smooth transition.
PEACHTREE CITY, GA – SEPTEMBER 4, 2025 – The Printed Circuit Engineering Association (PCEA) today announced Jackson Schultz, head of engineering at Rainmaker Technology, will keynote PCB West this fall.
MALAYSIA – Scanfil has officially inaugurated the expansion and modernization of its Johor Bahru facility in Malaysia, building its electronics and complex box-build manufacturing capabilities. The EUR 4.3 million investment, first announced in January, expands production space by nearly 50% and enhances efficiency, quality and capacity.