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ATLANTA – PCB Design Conference West returns to the Santa Clara (CA) Convention Center this March. The annual PCB West conference and exhibition is geared toward PCB engineering, design and manufacture professionals. Highlights of the March 25-30 conference include a two-day exhibition; 14 free technical sessions; free exhibitor presentations; a professional development certificate program of eight full-day tutorials and two design excellence curriculum two-day courses; a three-day technical conference of 26 short courses; and several free networking events. Mentor Graphics vice president and general manager Henry Potts will keynote the conference, talking on the intersection of PCB design, ICs and hardware.
 
The conference brochure is available for download at www.pcbwest.com. Registration is currently open.

PALO ALTO -- Hewlett-Packard scientists this month disclosed a new way to make nanoscale computer chips that reportedly increases by eightfold the number of transistors on a chip, without making the transistors smaller.

The HP team's concept involves layering a structure called a nanowire on top of a conventional silicon chip, to increase the number of interconnects. Also, most of the wiring from the silicon is removed, allowing the more transistors to be crammed on the chip.
Read more ...

TAIPEI -- Is ODM Asustek Computer going to follow the path blazed by Acer, BenQ Mobile and others and go head-to-head with its customers?

That's the talk -- and it's coming from the company itself.

Company spokesman Jonathan Tsang told DigiTimes the company plans to split its ODM and OEM production  within three years.

Asustek builds and markets motherboards, notebook PCs, servers, handsets and LCD TVs under the Asus brand. Sales from Asus notebooks are nearing those of contract revenues, Tsang said.

No decision has been made but the company plans to make a separation in three years, DigiTimes reported Tsang as saying.

SAN CLEMENTE, CA – Inspection equipment OEM YESTech has sold its 500th AOI system, the company announced today. Panasonic purchased the system for its Reynosa, Mexico, plant. Panasonic first purchased YESTech’s AOI in 2005.
 
SAN JOSE – The SMTA announced plans for the 4th Annual International Wafer-Level Packaging Conference and Exhibition.
 
This event will be held Sept. 18-19 in San Jose, and will focus on leading-edge IC packaging and test technologies with special emphasis on 3-D stacked packaging.
 
The event includes one day of workshops, a two-day technical program and two days of exhibits.
 
Submit 200-word abstracts to Melissa Serres at melissa@smta.org by March 23.
SONORA, MEXICOIndium announced signed an agreement with Multi Dicona to distribute soldering materials in Sonora, Mexico.

The deal covers Indium’s solder paste, rework flux, wave solder fluxes, liquid fluxes, solder bar, solid and flux cored wire, and tape and reel preforms.

Multi Dicona has more than 13 years’ experience in the printed circuit board industry and is working toward ISO 9000 certification.  
 
 
 

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