News
SAN JOSE -- The performance potential of high speed, copper based, direct interconnections between IC packages by means of a flexible circuit was validated by Intel Corp. in July at the IEEE CPMT Society's ECTC conference.
A paper, Flex-Circuit Chip-to-Chip Interconnects, was authored by team of scientists and engineers from facilities in Hillsborough, OR, Santa Clara, CA and Chandler, AZ. The authors concluded that “20 Gbps signaling on channels of relevant lengths is possible,” but noted that “we are not ready to introduce flex I/O into any mainstream products.” Even so, they did conclude that “the possibility of a chip-to-chip interconnect with minimal discontinuities and propagation loss is a strong attractor and corresponding high-speed solutions will be in demand.”
“We are delighted with both the quality of the Intel team's research and their reported results” noted SiliconPipe CEO and co-founder Joseph Fjelstad, “These results (20Gbps over extended distance) add significant credibility to SiliconPipe's concepts and validate the results SiliconPipe has presented to the electronics industry over the last few years, most recently in February at DesignCon West.”
SiliconPipe OTT technology (an acronym for Off-the-Top or Over-the-Top) can enable high-speed data requirements and low power potential.
“In our demonstration vehicle, code named Sidewinder, our team showed it possible to send signals at 10 Gbps over distances up to 30 in. through two connectors and do so using less than 2% of the anticipated transmission power while maintaining a 60% timing margin,” Fjelstad said. “However, there is still more benefit to mine and extract in this area and SiliconPipe is continuing to develop and evaluate new copper based interconnection solutions to meet the cost performance needs of future electronics and the Stair Step Package it appears will be an important element of that future.”
SAN JOSE -- The Nasdaq stock exchange has issued a delisting warning to Sanmina-SCI for the EMS firm's failure to file its quarterly 10-Q form.
In response, Sanmina-SCI has requested a hearing before the Nasdaq Listing Qualifications Panel.
In response, Sanmina-SCI has requested a hearing before the Nasdaq Listing Qualifications Panel.
Loughborough, England – The U.K. contract electronics group Datalink has acquired MSS/ Manufacturing Support Services, an Arizona contract manufacturer, and its associated electronics assembly company Servicios de Fabricacion based in Nogales, Mexico.
Since the acquisition, the assembly lines have been moved to more appropriate facilities, new surface-mount equipment has been installed, ESD precautions improved and MRP systems updated to manage full turnkey operations and trace ability. RoHS assemblies are now welcomed and ISO 9000 registration is scheduled for first half 2007.
Datalink concentrates on small- to mid-volume, low- to high-mix, through-hole, surface-mount and mixed technology PCB assembly.
VANCOUVER, BC -- Northstar Electronics reported second quarter revenues were down 4.8% to $346,152 versus last year.
For the three months ended June 30, the company incurred a loss of $213,335, up from a loss of $238,743 in 2005. Revenues include government assistance.
Northstar specializes in sonar technology, systems integration and electronics contract manufacturing.
For the three months ended June 30, the company incurred a loss of $213,335, up from a loss of $238,743 in 2005. Revenues include government assistance.
Northstar specializes in sonar technology, systems integration and electronics contract manufacturing.
LAUSANNE, Switzerland -- Synova has secured financing of $ 8.1 million, put up largely by Swiss banks, to develop micromachining centers (MMCs) in key high-tech regions worldwide.
The MMCs are designed to fuel adoption of Synova's Laser MicroJet technology. With over 50 full-production machines at 30 different customer sites, the company is committed to developing localized centers to allow quick customer support. With the technology already qualified in the electronics market, the new financing will allow the company to delve into other industries and application areas.
"This funding comes at a pivotal time for Synova," said its chief executive, Bernold Richerzhagen. "Laser MicroJet has experienced phenomenal traction in recent years, and our global expansion efforts are aligned with the market's demand for innovative cutting technology. Our MMCs will allow us to effectively anticipate and serve the needs of our global customer base as we further penetrate not only the semiconductor market, but also burgeoning, precision-centric sectors such as inkjet print-head MEMS, hard disk drives and organic light-emitting diodes."
Last month, Synova announced that its first MMC, located in the Silicon Valley, will open in January 2007. It will feature an applications lab and the most recent Laser MicroJet tool -- the LDS 300 A. Future MMCs, planned to open throughout 2007 and 2008, will house similar tools.
The MMCs are designed to fuel adoption of Synova's Laser MicroJet technology. With over 50 full-production machines at 30 different customer sites, the company is committed to developing localized centers to allow quick customer support. With the technology already qualified in the electronics market, the new financing will allow the company to delve into other industries and application areas.
"This funding comes at a pivotal time for Synova," said its chief executive, Bernold Richerzhagen. "Laser MicroJet has experienced phenomenal traction in recent years, and our global expansion efforts are aligned with the market's demand for innovative cutting technology. Our MMCs will allow us to effectively anticipate and serve the needs of our global customer base as we further penetrate not only the semiconductor market, but also burgeoning, precision-centric sectors such as inkjet print-head MEMS, hard disk drives and organic light-emitting diodes."
Last month, Synova announced that its first MMC, located in the Silicon Valley, will open in January 2007. It will feature an applications lab and the most recent Laser MicroJet tool -- the LDS 300 A. Future MMCs, planned to open throughout 2007 and 2008, will house similar tools.
High Wycombe, England -- The U.K.-based SMART Group is hosting three events this fall that center around Pb-free assembly and the RoHS/WEEE legislation.
Troublshooting your Assembly Process + Lead-Free Clinic will take place on Sept. 26 at the Oxfordshire Conference Centre in Thame. The program will look at the practical problems of Pb-free in manufacture and failures in the field, focusing on potential and current issues. Delegates can also bring their own manufacturing issues for free support from the “SMART Lead-Free Advice Clinic;” delegates can also email questions in advance to be answered in “LEADOUT Question Time”.
The next event, a Practical Lead-Free Rework & Repair Workshop, will take place in the same location on Oct. 11. It provides an opportunity to learn different repair procedures and techniques. During the event, each delegate will have a Pb-free board to hand solder or rework with a selection of alloys and inspect to gain first-hand experience.
On Nov. 7, the Wycombe Football Club Conference Centre will host the SMART Group Legislation Update. This event will follow on from RoHS, with what has happened since the July 1 implementation, and look at other legislation challenges, including WEEE, EuP and REACH.
For more info., visit smartgroup.org.
Troublshooting your Assembly Process + Lead-Free Clinic will take place on Sept. 26 at the Oxfordshire Conference Centre in Thame. The program will look at the practical problems of Pb-free in manufacture and failures in the field, focusing on potential and current issues. Delegates can also bring their own manufacturing issues for free support from the “SMART Lead-Free Advice Clinic;” delegates can also email questions in advance to be answered in “LEADOUT Question Time”.
The next event, a Practical Lead-Free Rework & Repair Workshop, will take place in the same location on Oct. 11. It provides an opportunity to learn different repair procedures and techniques. During the event, each delegate will have a Pb-free board to hand solder or rework with a selection of alloys and inspect to gain first-hand experience.
On Nov. 7, the Wycombe Football Club Conference Centre will host the SMART Group Legislation Update. This event will follow on from RoHS, with what has happened since the July 1 implementation, and look at other legislation challenges, including WEEE, EuP and REACH.
For more info., visit smartgroup.org.
Press Releases
- FlashPCB Expands into New Facility, Enhancing Manufacturing Capabilities
- FlashPCB Expands into New Facility, Enhancing Manufacturing Capabilities
- Evolve Manufacturing to Strengthen Supply Chain and Advance Medical Device Quality
- Federal Electronics Expands Advanced Manufacturing Capabilities with New Class 10,000 Cleanroom