SAN JOSE -- Randy Furr, president and chief operating officer of Sanmina-SCI
Corp. for the past 9 years, is
leaving the company for personal and family reasons.
Furr was named president and COO in March
1996. He joined the company as chief financial officer in August 1992.
Furr will also resign as a director.
ORMOND BEACH, FL -- Noted soldering and reliability expert
Werner Engelmaier will produce three workshops on solder joint
reliability in Boston in December.
The workshops are part of the Engelmaier Series of Solder Joint Reliability, and will take place Dec. 5.
The Dec. 5 workshops include: Fundamentals in Solder Joint Reliability; Failure Mode and Root Cause Analyses (Fatigue, Brittle
Fracture, ENIG); Acceleration Models, Reliability Tests and Screening Procedures. They take place at Philips
Medical Systems in Andover, MA.
A fourth workshop will be
presented Dec. 6, as part of the IPC/JEDEC 11th International
Lead-Free Conference, also in Boston.
Registrations are required. For more information, email engelmaier@aol.com.
PALO ALTO, CA — Frost & Sullivan today named Plextronics Inc. recipient
of the 2005 Technology
Innovation of the Year Award in the field of printed electronics. The
award recognizes the company’s significant contributions toward the
development of conductive polymer technology, trademarked Plexcore,
which will help enable broad market commercialization of a wide variety
of organic electronics devices.
Frost & Sullivan makes the award annually to a company that has carried out new research, which has
resulted in innovation(s) that have or are expected to bring
significant contributions to the industry in terms of adoption, change,
and competitive posture. The Award recognizes the quality and depth of
a company’s research and development program as well as the vision and
risk-taking that enabled it to undertake such an endeavor.
"An intimate understanding of the
relationship between polymer structure, the resulting physical
properties of the polymer, and finally its impact on the performance of
organic electronic devices have been applied in the conception of
Plexcore technology," said Frost & Sullivan research analyst
Archana Jayarajah. "The company’s core technology is based on
regioregular polythiophenes that have excellent physical and
electrical properties and scalability - the key factors for its
successful market application."
Plextronics approach to the design and
synthesis of conductive polymers has helped the company’s researchers
tailor fundamental material properties such as structure, molecular
weight, polydispersity, energy level, and end-group functionality for
specific end-user needs. The ability to control these variables has
enabled the development of application-specific polymer technologies
that cost effectively maximize device performance and has resulted in
innovations that are patentable and virtually difficult to replicate.
Products based on the Plexcore technology
include Plexcore OS, Plexcore HIL, Plexcore PV, and Plexcore TS.
Plexcore OS is an organic semiconductor that can help in the
fabrication of a new class of low power electronic devices. Plexcore
HIL is a solvent-based ink that when printed using spin-cast or inkjet
techniques forms transparent, partially conductive thin-films referred
to as a ‘hole injection layers’. Plexcore PV, a class of
semi-conductive polymers, can strongly absorb sunlight and generate
electric charges required to function as a solar cell. Plexcore TS, a
solvent-based ink, can be printed using spin-cast or inkjet techniques
to form transparent, highly conductive, flexible thin-films.
On the whole, organic electronics is
still a relatively new field in which only a few companies can claim to
have substantial expertise. Plextronics, on the other hand, benefits
from over 15 years of innovation in this area and its core technology
has already helped catalyze the development of conductive polymers
toward broad commercialization.
"Plextronics’ core technology has
catalyzed the development of conductive polymers toward broad
commercialization. Few companies in this field offer materials and
formulation expertise as well as extensive device fabrication
capabilities," said Jayarajah.
SARATOGA, CA – The average selling price for ICs is expected to resume
growth in the first quarter of 2006, following a 15% decline from a
high in January 2005 and a stagnation in August at $1.58. Advanced
Forecasting Inc. predicts that the continued increase in sales of IC units
will strengthen fab capacity utilization rates, driving ASPs upward,
thus fueling a forecasted upswing in the semiconductor cycle in 2006.
Although the ASP decline since February strongly resembles that of the
2001 recession, AFI said, today’s situation is different and
substantially more optimistic. “Overheating of IC revenues and IC units
relative to their forecasted underlying demand is a non-issue, whereas
in 2000 it was significant,” said Rosa Luis, director of marketing and
sales.
The situation also differs from 2000 in which the forecasted
growth rate of underlying demand sustained a decline while at the same
time IC sales continued to soar, exacerbating the gap between the true
demand and actual shipments.
“The current robustness of IC unit sales
corroborates our forecast for fab utilization that showed growth into
Q4 2005. As IC units continue to grow, fab utilization rates will
increase until supply is constrained, forcing prices upward,” said
Luis.
“Fab capacity utilization has been an accurate measure of the
health of the semiconductor industry. Fab capacity stood at 1.44
million wafers per week (8” equivalent) and its utilization reached 89%
in Q2 2005, up from an 86% minimum point in Q1 2005, in line with our
forecast,” said Luis.
In comparison, foundries were operating at 83%
utilization in September, significantly lower than the 99% level of a
year ago, and partially due to the increased foundry capacity of 35%
during the last year.
State-of the-art (300mm) fab capacity doubled
since Q1-04 to 100K wafers per week. Its utilization hovered around 91%
in Q2-05, slightly below the previous quarter’s level of 93%.
FRANKLIN, MA – Speedline Technologies will address the issues involved with the challenge of tin whiskers in SMT manufacturing during a free, live, one-hour Web seminar on Thursday, Nov. 17, at 11 a.m., EST
The challenge of tin whiskers – the small protrusions of tin that can grow from tin-plated surfaces, causing electrical short circuits – has plagued the electronics industry for years. Concern has recently accelerated with the use of lead-free solders that are high in tin content.
Especially troublesome for high reliability applications such as military, medical and automotive manufacturing, research into the cause – and cure for – tin whiskers continues. Most agree that the whiskers are caused by the compressive stress of the tin-plating process.
Topics will include causes and types of tin whiskers; prevention of whiskers; and where to find additional information on the phenomenon.
For more info. and to register, visit speedlinetech.com/seminars
Carlsbad, CA –Asymtek, Dow Corning, Emerson & Cuming, Henkel Technologies and Humiseal are planning a conformal coating and dispensing workshop on Nov. 8 at the Center for Board Assembly Research/ Manufacturing Research Center (MARC) at Georgia Tech University in Atlanta. The event will feature new information on conformal coating, and the best practices for jetting and other electronic assembly dispensing from both material and equipment perspectives.
Topics will include: How to select, cure and apply different coating materials (aqueous, acrylic, silicone, and heat-humidity cure materials); Fluid jetting processes and material applications, including the advantages of non-contact jetting underfill and other fluid materials for electronics assembly; Live demonstrations of coating and jetting applications on equipment.