MILPITAS, CA – Solectron Corp.,
a provider of electronics manufacturing and integrated supply chain
services, has reported the resignation of executive vice president and
CFO. Kiran Patel is leaving Solectron to become CFO for Intuit Inc.
Warren Ligan, senior vice president and corporate controller at
Solectron, will fill Patel's role on an interim basis while an
internal and external candidate search is conducted.
"Kiran
has been a driving force in the transformation of Solectron and we
thank him for his many contributions," commented Mike Cannon, president
and CEO of Solectron. "Moving forward with Warren
as interim CFO, we are assigning a proven performer from our strong
internal team of financial professionals to this key position."
HERNDON, VA — The International Electronics Manufacturing Initiative consortium next month will sponsor a "state of the industry" forum on RFID technology.
The meeting is scheduled for Oct. 4, at Sun Microsystems in Newark, CA.
STUTENSEE-BLANKENLOCH, GERMANY – Test solutions provider Digitaltest has added a local distributor on South America. Macon SRL will provide sales and service representation for Digitaltest's range of in-circuit, flying probe and functional test equipment.
In a statement, Digitaltest's Hans Baka said, "Many of our global customers now require support on their doorsteps – a trend that has seen Digitaltest expand its presence in several key geographies over the last few years.”
BINGHAMTON, NY – Endicott Interconnect Technologies has selected the AdVantis and Polaris platforms from Universal Instruments Corp. for military product applications, Universal said today.
The companies said the platforms were selected in order to automate production of a chip carrier for a leading military supplier. The product features several hundred surface-mount components, several memory devices and a very large heat spreader, the companies said.
AdVantis is a flip chip placement system; Polaris handles multiple assembly processes, including dispensing and underfill.
EI is a spinoff from IBM and builds chip packages, printed circuit boards and electronics assemblies.