Circuits Assembly Online Magazine - Market News

News

The CLM9000plus from ESSEMTEC (Glassboro, NJ) is based on a new software and hardware platform. The mechanical improvements include a complete new drive system which results in 20% placement speed increase, as well as improved accuracy and repeatability. Improved bearings result in longer lifetime and less wear. A newly available calibration set that includes glass plates and components allows customers to verify on-site the accuracy of the machine if needed for ISO9000 protocols.

The software is based on the Easyplacer plattform and includes new possibilities to run complete sets of boards or place single boards in multiple boards in any angle in the machine. Automatic height detection of the feeders is now integrated and the software includes an improved link to the management information system software that optimizes the production and keeps track of components and production data.

The integrated vision system from Cognex accurately locates fiducials marks, but also allows to placement beside micro ball grid arrays (BGAs), BGAs, fine pitch components and odd-shape components.

The bad mark sensing option excludes boards automatically from placement or dispensing. Free definable marks can be taught and verified. The new multi field of view option centers and inspects components up to 65 x 65 mm.

Up to 190 feeders with LED indication can be mounted and are now directly linked with ESSEMTEC's MIS system to load/reload components while the machine is placing. The machine can be equipped with a bar code-based set up control to eliminate possible set up errors.

www.essemtec.com

Endicott Interconnect Technologies (Endicott, NY) has announced a $10 million capital expansion program to meet demand in all of its products, especially in the defense and aerospace markets. Much of the funding will be spent on equipment that will enter production during the second half of this year.

"Endicott Interconnect's printed circuit board (PCB), semiconductor packaging and complex electronic assembly business are all experiencing strong growth, and this additional expansion will position us to meet our customers' demands this year," said Jim Herard, marketing manager.

The capital package includes monies for equipment to produce PCBs greater than 28 in. long and additional lamination capacity for high performance materials. Other capacity increases for semiconductor packaging production and printed wiring board production are also included.

Also included in the package were funds for expansion and equipment for the production of complex electronic assemblies that will enter volume production later this year and additional funding for expansion in the precision machining area to be used for production of the SureScan explosive detection system announced previously by Endicott Interconnect.

www.endicottinterconnect.com

Ultrasonic Systems Inc. (Haverhill, MA) has developed a new solution to apply no-clean, low solids flux for lead-free wave soldering. Nozzle-free Ultra-Spray technology with reciprocating motion enables the proper amount of flux to be applied uniformly and repeatably with complete through-hole penetration.

The higher operating temperatures of lead-free alloys require flux chemistries with stable activators, excellent wetting properties and minimal post wave residue. But flux chemistry alone cannot guarantee good soldering success. Precision fluxing technology is the solution. Too little flux can cause bridging and poor wetting. Poor through-hole penetration can result in insufficient solder joints. Too much flux can cause solder balls or leave harmful residues that are not removed in modern no-clean operations.

Visit the company's Web site to learn more about the lead-free spray fluxing solution.

www.ultraspray.com

The National Electronics Manufacturing Initiative (NEMI, Herndon, VA) has announced that Centor Software Corp. (Irvine, CA), Foxconn (Taiwan), MatrixOne (Westford, MA), Microsoft (Redmond, WA) and Speedline Technologies (Franklin, MA) are the latest companies to join the industry-led consortium.

"NEMI attracts organizations from across the supply chain, and this latest group of new member companies demonstrates our broad range of appeal," said Jim McElroy, executive director and chief executive officer of NEMI. "Our newest members include a major original equipment manufacturer (OEM) (Microsoft), a major component module move service (CMMS) provider (Foxconn), two software solution providers (Centor and MatrixOne) and a capital equipment manufacturer (Speedline). Our methodology brings together diverse interests and fosters a collaborative environment that benefits the entire industry. These new participants further strengthen our membership base and improve our effectiveness in facilitating change as we address gaps in the global electronics manufacturing infrastructure."

Dan Camarda, vice president of marketing with Centor, said, "NEMI member firms face a wide range of challenges in dealing with environmental concerns, specifically RoHS transition issues such as materials declarations. Centor is pleased to have the opportunity of working in collaboration with NEMI firms in leveraging our experience to help drive industry-standard solutions for these challenges."

Centor Software Corp. provides business analytics applications for manufacturers focused on the end-of-life and customer use stages of a product's lifecycle. Its suite of applications helps decision makers reduce regulatory compliance costs and improve product quality, ultimately increasing customer satisfaction, lowering product lifecycle costs and reducing producer liabilities. Centor's customer base includes OEMs and supply chain companies in the automotive, electronics, electrical equipment and aerospace industries.

Hon Hai Precision Industry Co. Ltd., with the registered trade name Foxconn, is an integrated global CMMS provider. The company specializes in components, modules, moves and services for computers, communications and consumer electronics. With subsidiaries and operations throughout the Americas, Europe and Asia, Foxconn is a manufacturer of PC connectors, motherboards and PC system integration..

MatrixOne Inc. delivers collaborative product lifecycle management (PLM) solutions. The flexible solutions unleash the creative power of global value chains to inspire innovations and speed them to market. The company's from the aerospace and defense, automotive, consumer products, high technology, life sciences, machinery and process industries include Agilent Technologies, General Electric, Honda, Johnson Controls, Philips, Procter & Gamble, Siemens, and Toshiba.

Founded in 1975, Microsoft is a provider of software, services and solutions that help people and businesses realize their full potential. Microsoft's Home and Entertainment Division products include Xbox game consoles and accessories and PC hardware such as keyboards, mice and other devices.

Speedline Technologies is a provider of single-source process knowledge, solutions and service to the printed circuit board assembly and semiconductor packaging industries. The company sells five brands: ACCEL microelectronics cleaning; CAMALOT dispensing systems; ELECTROVERT wave soldering, reflow soldering and cleaning equipment; MPM stencil and screen printing systems; and PROTECT global services, support and training solutions.

www.nemi.org

www.speedlinetech.com

Assembly Technology Expo (ATExpo) will mark its 25th anniversary as the trade show kicks off on Sept. 28-30, 2004, in Rosemont, IL. The ATExpo conference opens one day earlier on Sept. 27.

The event features a showcase of assembly solutions, from advanced robotic systems to hand tools. Nearly 600 suppliers will display and demonstrate new products in more than fifty categories, for use in a range of manufacturing industries, including: automotive, electronics, industrial equipment, computers, household appliances, motors and generators, medical, telecommunications and aeronautics/aerospace.

The conference will offer ten free special events as part of the Free Educational Program. The program is highlighted by three entertaining and informative keynote presentations.

The opening keynote, "Made in America," will be presented by television star John Ratzenberger, the producer and host of the Travel Channel's John Ratzenberger's Made in

America series. On the second day, "A Tale of Two Rovers—Integrating, Testing and Operating the Mars Exploration Rovers," will be delivered by Christopher Salvo, Mission Manager, Mars Exploration Rover for NASA/Jet Propulsion Laboratories. And on Sept. 30, Karl Eberle, vice president and general manager of Harley-Davidson's Kansas City assembly facility will share manufacturing successes in the revolutionary, "Relationship Driven Leadership, a Unique Manufacturing Environment."

The conference offers over 30 sessions organized into six tracks: Adhesives,

Automated Assembly, Lean Manufacturing, Manufacturing Management, Materials

Joining and Wire Processing. The organizations presenting conference sessions at the conference include: The Automated Imaging Association (AIA), APICS - the Educational Society for Resource Management, the Adhesive and Sealant Council (ASC), the Edison Welding Institute (EWI), the Robotic Industries Association (RIA), the Wiring Harness Manufacturers Association (WHMA) and ASSEMBLY magazine. Sessions will focus on a variety of topics, including lean production, flexible assembly and robotics in assembly.

Three dedicated technology pavilions make it easier for attendees to locate the specific products and suppliers they want to see. The Electronics Manufacturing Pavilion features nearly 200 suppliers offering solutions for every phase of the electronics manufacturing process, from design, packaging and fabrication to assembly and test. The pavilion also features the EASi Line, a working assembly line that incorporates sample equipment from the areas of material handling and transport, stencil printing, component pick-and-place, reflow wave solder, visual and x-ray inspection, robotic point-to-point soldering, packaging, microcontroller programming, and factory modeling and simulation. This year's line will manufacture a Light Chaser game that visitors can take home.

The Robotics Pavilion, endorsed by the RIA and AIA, is the place to find industrial robotics, flexible automation, machine vision solutions and related technologies.

The Wire Harness Pavilion showcases wire-processing solutions. Endorsed by the Wire Harness Manufacturers Association, the pavilion features new products and services for electronic cable assemblies, cord sets, wiring harnesses and other products within the wire processing industry. The Wire Processing Assembly Line (WPAL) theme this year is, "Lean Sigma Technologies To Support Wire and Cable Processing."

www.atexpo.com

Cookson Group plc (London, UK), an international materials technology company, announced the appointment of Nick Salmon as Group Chief Executive.

Salmon has held leadership positions within major international organizations over many years. At Babcock International plc, the engineering services group, he was chief executive from 1993 to 1997. From 1997 to 2001, Salmon was executive vice president of ABB Alstom Power and president of Alstom's Energy Sector. From 2001 until March of this year, he was executive vice president of Alstom SA.

In May, Cookson announced that Stephen Howard intended to relinquish the role of group chief executive, after the identification and appointment of a successor. Howard will step down as on July 19, and will continue as an executive director until the end of the year.

The company also announced the appointment of Jan Pieter Oosterveld as a non-executive director, with immediate effect.

Oosterveld spent his career at Royal Philips Electronics. Until his retirement in March, he was a member of the Group Management Committee, CEO of Philips Asia Pacific, Chairman of the Board of Directors of LG.Philips LCD Seoul, South Korea and Vice-Chairman of the Supervisory Board of LG.Philips Displays NV, Hong Kong.

www.cooksongroup.co.uk