News
BANNOCKBURN, IL – Total North American PCB shipments in May were down 6.8% compared to the same month last year, IPC announced. The book-to-bill ratio stands at 0.95.
PEACHTREE CITY, GA – Abstracts for next year’s PCB East technical conference are due September 6, 2024, the Printed Circuit Engineering Association (PCEA) said today. The conference, the largest of its kind in New England, takes place next spring in the Boston suburbs, and focuses on training and best practices for printed circuit board design engineers, electronics design engineers, fabricators and assemblers.
BANNOCKBURN, IL – North American EMS shipments in May were up 5% compared to the same month last year, according to IPC's North American EMS Statistical Program. The book-to-bill ratio stands at 1.36.
ARENDAL, NORWAY – Kitron is planning a 7,500 sq. m. production facility here, with plans for completion during the first half of 2026.
SENAI, MALAYSIA – VS Industry Berhad reported a slight increase in third quarter revenue to MY1.01 billion ($214.4 million) from MYR996.8 million ($211.5 million) in revenue during the same period last year.
MILPITAS, CA – To keep pace with unremitting growth in demand for chips, the global semiconductor manufacturing industry is expected to increase capacity by 6% in 2024 and post a 7% gain in 2025, reaching a record capacity high of 33.7 million wafers per month (wpm: 8-inch equivalent), SEMI announced in its latest quarterly World Fab Forecast report.
Press Releases
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Ryder Vietnam - Phase 2: Building resilience and meeting demand
- Scanfil and Etteplan deepen their strategic partnership into production testing