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LOUISVILLE, KY – Sypris Solutions Inc. reported fourth-quarter 2007 revenue of $103.7 million, down 5.3% year-over-year.
SCHAUMBURG, IL – Papers are sought for the International Military & Aerospace/Avionics COTS Conference, Exhibition and Seminar, to be held Aug. 4-6 in Schaumburg, IL.
Papers are sought on commercial plastic-encapsulated components for use in high reliability applications. Specific topics may include reliability; testing; implementation; development; processing; specification generation; procurement (market, sourcing and supply problems); radiation hardness; Pb-free applications, and prognostics.
Abstracts are due April 18 and must include the title, author(s), affiliation and address.
After acceptance, material to be included on a conference proceedings CD is required by July 18.
Papers are sought on commercial plastic-encapsulated components for use in high reliability applications. Specific topics may include reliability; testing; implementation; development; processing; specification generation; procurement (market, sourcing and supply problems); radiation hardness; Pb-free applications, and prognostics.
Abstracts are due April 18 and must include the title, author(s), affiliation and address.
After acceptance, material to be included on a conference proceedings CD is required by July 18.
NORTH BILLERICA, MA – BTU International reported fourth quarter net sales of $18.3 million up 10% year-over-year. Net income for the quarter was $600,000, down 40% year-over-year.
OXFORD, CT – AOI supplier Mirtec Corp. reported sales revenue for its North American division grew 23% in 2007.
President Brian D’Amico attributes the company’s growth to the recent introduction of two new AOI platforms.
“I am delighted to report our first quarter sales revenue has already surpassed our first quarter results for last fiscal year. We look forward to our continued growth in 2008,” D’Amico stated.
RENO, NV – Continued growth is expected in automotive electronics, with forecasts calling for annual growth of 9% through 2013. Growth in driver assistance, safety systems and entertainment are expected to be particularly strong, says a new report.
OXFORD, UK - BizEsp Limited has announced the launch of Oxford Solders for electronics assembly products.
The product line will reportedly be marketed toward Chinese and Indian manufacturers, and will include solder powders and pastes, fluxes and BGA spheres.
The company claims strict adhesion to environmental laws.
The company will reportedly provide local service, support and training to clients in China and India. Mauricia Wang, business manager for China, will head client service operations. Wang has stated that the company is concerned about the environment and resource and energy sustainability, and their impact on the global economy, particularly in China.
With this in mind, the company will reportedly offer products based on environmentally responsible European and American technologies, and offer these "green" products to China at prices that are locally competitive, along with claimed higher customer service standards than those currently offered in China.
The company will display its products at the Nepcon shows in Shanghai and Shenzhen.
Press Releases
- ZESTRON Hosts Webinar on “Electronic Assembly Failures, Solutions and Lessons Learned for Long Term Reliability”
- Surface-Mount Innovations Delivering More for Less
- Freemelt to Outsource Production to Scanfil
- TAGARNO and Comtree to Host Live Webinar on Digital Microscopes in Canadian Electronics Manufacturing; Jake Kurth Comments