JASPER, IN – Kimball Electronics has acquired the assets of Indianapolis-based contract manufacturer Aircom Manufacturing for an undisclosed sum.  

AUSTIN, TX – Fan-out wafer level packaging (FO-WLP) continues to show growth momentum, says TechSearch, with multiple parts found in Samsung’s Galaxy phones and many packages expected in Apple’s next iPhone. Companies are researching large area panel processing as a result of constant pressure to lower cost.

PORTLAND, OR – The 2016 Medical Electronics Symposium will be held Sept. 14-15 at Marylhurst University.

GARBSEN, GERMANY -- A new study from LPKF shows effects of changes in individual process parameters on stencil manufacturing.