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TAIPEI – Hon Hai (Foxconn) plans to close operations at a mobile phone facility in southern India as a result of customer changes, according to reports.
DORNSTADT, GERMANY – The 8th ASYS Group Technology Days brought some 400 customers and partner companies together to observe a full working SMT line and listen to several live electronics assembly seminars.
AYLESBURY, UK – Nordson Dage has developed a new test method for the evaluation of die strength by means of cantilever bending, where three-point bending is not suitable for die with a thickness of fewer than 50µm.
EARTH CITY, MO -- Raven Industries will close its facility here by next fall and lay off 58 workers.
FRANKLIN, MA – Pat O’Brien will take over as vice president and general manager of Speedline Technologies on Jan. 1. O’Brien is currently vice president and general manager of ITW Thermal Processing.
SAN JOSE — Worldwide semiconductor manufacturing equipment orders rose 4% year-over-year to $9.32 billion in the third quarter, SEMI said.
Press Releases
- SASinno Americas Welcomes Two Industry Veterans to Strengthen Sales and Technical Support Across the Americas
- ITW EAE Expands Production Capabilities for Centurion Reflow Ovens and Momentum II Printers
- Kyzen Promotes Erik Miller to Chief Operating Officer
- DOBOT Malaysia Opens to Accelerate Smart Manufacturing in Southeast Asia