Hysol QMI536NB is a new die attach material for stacked die applications that require extremely low stress and robust mechanical properties. The material is qualified for Pb-free environments and provides an alternative to film die attach. Enables users to qualify a single material for stacked die packages. (Traditionally, different die attach materials are used for the various layers of a stacked package to avoid damage to the die passivation of the first die.)  With its protective and low-bleed formulation, the novel material can be used for both mother and daughter die.
 
Accelerated Cooling (AC) process for flip-chip manufacturing is used in conjunction with Henkel’s non-conductive paste (NCP) underfill encapsulants, Hysol FP5000 and Hysol FP5001. It enables rapid cooling of the device prior to any excessive heat exposure; is said to reduce warpage and voids while improving cycle time by nearly 50% over that of previous thermal compression processes. 
 
Hysol QMI529LS and Hysol GR828A material set is a die attach and mold compound combination designed specifically for thin and ultra-thin surface mount device applications. Both are optimized for Pb-free environments and provide the thin, yet reliable, materials characteristics required for low-profile consumer electronics.
 
Henkel Corp., electronics.henkel.com

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