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WASHINGTON – National Association of Manufacturers’ president and CEO John Engler called this week's National Surface Transportation Policy and Revenue Study Commissions’ recommendations for funding the nation’s infrastructure network an “excellent platform to begin discussing how to improve the U.S. transportation system.”

After nearly two years of nationwide hearings, the 12-member commission issued the report analyzing the needs of U.S. surface infrastructure over the next 30 years. The report offered recommendations to address urban congestion, rural access, project delivery and freight needs.

“Modernizing our nation’s infrastructure system is a top priority of manufacturers,” Engler said. “We depend on the ability to move goods throughout the country efficiently yet face transportation bottlenecks that cost industry nearly $8 billion a year.

"The commission reached a consensus on the clear need to increase investment in our nation’s transportation system to lessen these bottlenecks,” he said. “While there are bound to be differences among commissioners over the level or source of funding, these differences do not diminish the compelling case for additional investment.”

Congress will begin discussing reauthorizing funding for the surface transportation program this week with Chairman James Oberstar’s (D-MN) hearing on this report in the House Transportation and Infrastructure Committee.

“Congress should look at mix of investment sources from all levels of government – federal and state – as well as public-private partnerships,” Engler said. “The time is now to work together to find a solution to this complex problem,” he said. “The U.S. will soon be facing a competitive disadvantage if we don’t develop a national plan to improve the quality of our infrastructure system like our international trading partners.”

The National Surface Transportation Policy and Revenue Study Commission’s recommendations are available at transportationfortomorrow.org.

NATICK, MA -- Machine vision equipment OEM Cognex Corp. has named Dr. Makoto Inoue president of Cognex K.K., the company’s Japanese subsidiary, responsible for sales, marketing, engineering and technical support in Japan. He will oversee five offices and more than 100 employees.

He replaces Hiro Ohgusu, who joined Cognex in 1990 and who remains on Cognex K. K.'s board of directors.

He reports to Eric Ceyrolle, executive vice president of worldwide sales and marketing.

Dr. Inoue spent the previous 30 years with Komatsu Ltd., a manufacturer of industrial machinery and equipment, most recently as CEO and president of Komatsu Electronics Inc. 
TRENTON, NJ -- The governor of New Jersey this week signed a law banning electronics devices from state garbage cans and landfills after Jan. 1, 2009.

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SAN JOSE – North American-based semiconductor equipment manufacturers saw orders slip 18% year-over-year in December, the SEMI trade group said today.

For the month, manufacturers posted $1.23 billion in orders, up 9% over November.

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SHANGHAI — “China is an important and growing manufacturing hub in the global electronics industry, and we are making a concerted effort to increase our presence and consortial activities here in order to serve the needs of our members who are already running significant operations in this region, and also to help those fast-growing Chinese companies to become international players by providing well-integrated global solutions.”

So said International Electronics Manufacturing Initiative chairman Nasser Grayeli, vice president, technology and manufacturing of Intel, as the trade group celebrated the grand opening of its Shanghai office.


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SAN JOSE – Joseph Fjelstad, president of Verdant Electronics, will keynote Meptec’s 4th Annual Thermal Management symposium. 
 
This one-day technical event will be held Feb. 28 in San Jose.
 
Fjelstad will trace the history of thermal management across the various stages of electronics and at different hierarchical levels, reviewing some of the innovative ways thermal management engineers have responded to the challenges over time in his presentation, Beating the Heat – Dealing with the Thermal Challenge: Past, Present and Future. The presentation will conclude with a look at some of the new and prospective materials and methods that the thermal challenge might be addressed in the future.
 
To register, visit www.meptec.org.
 

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