News
ELKHART, IN -- CTS Corp., a manufacturer of electronic
components and sensors and a provider of EMS
services, will build a manufacturing operation in Ostrava, on the eastern border of the Czech Republic. Production is expected to start mid-2006. The facility will initially manufacture automotive products for the European market.
services, will build a manufacturing operation in Ostrava, on the eastern border of the Czech Republic. Production is expected to start mid-2006. The facility will initially manufacture automotive products for the European market.
In a press statement, vice president and general manager of CTS automotive products Jeff McCurley said, "Our European sales are projected to double in the next five years. Expansion of our European manufacturing presence to the Czech Republic will better serve our European automotive customers. Locating our new plant in Ostrava offers low costs, availability of technical skills and necessary manufacturing infrastructure," added McCurley.
CHANDLER, AZ -- Isola said it might raise prices up to 10% due
to cost increases in various raw materials for laminate and prepreg
products. A decision is expected in a few weeks.
Price inflation has been rampant for such materials as hydrocarbon-based products, copper and even oil. In a press release, Tim McCloskey, vice president sales, Americas, said, “Recent increases in the prices of all hydrocarbon-based products are having a significant impact on the cost structure throughout the Isola product line. In addition, rising oil prices have increased operating costs through higher natural gas prices and freight surcharges. Copper prices continue at record levels in the commodity markets, driving recent increases from the producers of electrodeposited copper foil."
"Our goal is to keep any potential increase in the 8 to 10% range. While we regret that this action may be necessary, it is quite clear that the entire supply chain in electronics manufacturing is similarly affected”, said McCloskey.
Recently, a pair of major Japan-based laminate producers raised prices about 10%.
An announcement detailing the pricing for Isola products is anticipated in the coming weeks.
Price inflation has been rampant for such materials as hydrocarbon-based products, copper and even oil. In a press release, Tim McCloskey, vice president sales, Americas, said, “Recent increases in the prices of all hydrocarbon-based products are having a significant impact on the cost structure throughout the Isola product line. In addition, rising oil prices have increased operating costs through higher natural gas prices and freight surcharges. Copper prices continue at record levels in the commodity markets, driving recent increases from the producers of electrodeposited copper foil."
"Our goal is to keep any potential increase in the 8 to 10% range. While we regret that this action may be necessary, it is quite clear that the entire supply chain in electronics manufacturing is similarly affected”, said McCloskey.
Recently, a pair of major Japan-based laminate producers raised prices about 10%.
An announcement detailing the pricing for Isola products is anticipated in the coming weeks.
NORTH BILLERICA, MA -- The recovery continues at BTU
International, which
last night said third-quarter net sales rose 20% to $18.5 million,
while earnings jumped to $1.6 million from a loss of $2.4 million last
year.
For the quarter ended Oct. 2, net sales were up 17% and net income doubled sequentially.
For the quarter ended Oct. 2, net sales were up 17% and net income doubled sequentially.
Minneapolis, MN -- The SMTA has added four new board members to serve three-year terms. New to the board are: Dr. Dan Baldwin, Engent; Dr. Denis Barbini, Vitronics-Soltec; Jim Kuehn, Tyco Electronics Automation Group; and Dr. Ning-Cheng Lee, Indium Corp. of America.
They will join these existing members: president David Raby, STI Electronics; VP technical programs Dr. Ken Gilleo, ET-Trends; VP communications Steve Greathous, Intel Corp.; secretary Irene Sterian, Celestica; Planning Committee chairperson Bill Barthel, Plexus Corp.; and Planning
Committee members Dick Russell, Phoenix Designs; Emmanuel "Manno" Siméus, Raytheon Missile Systems; and Dr. Laura Turbini, University of Toronto.
They will join these existing members: president David Raby, STI Electronics; VP technical programs Dr. Ken Gilleo, ET-Trends; VP communications Steve Greathous, Intel Corp.; secretary Irene Sterian, Celestica; Planning Committee chairperson Bill Barthel, Plexus Corp.; and Planning
Committee members Dick Russell, Phoenix Designs; Emmanuel "Manno" Siméus, Raytheon Missile Systems; and Dr. Laura Turbini, University of Toronto.
New Tripoli, PA – High demand for digital consumer and mobile applications is driving demand for high-density packages, according a recent report by The Information Network. The group projects total HDP market growth of 32% in 2005, reaching 1.5 billion units.
“High-density packages result in a smaller overall package when compared to packaged components performing the same function,” said Dr. Robert N. Castellano, president. “They are ideal for small portable devices such as cellphones, digital audio and Bluetooth-enabled products.”
The report projects 21% growth in 2006, to 1.8 billion units.
The HDP was dominated by the Communications sector in 2003, which held a 82.9% share, followed by the Consumer sector with an 11% share. These sectors are predicted to rise 76.4% and 18%, respectively, by 2008.
System-in Package (SiPs) represented 61.1% of the MCM-L market in 2003 but will grow to a 72.9% share in 2008.
“From a technical perspective there is indeed a difference between MCM, MCP and SiP in the incorporation of passive components,” added Dr. Castellano. “From a market analysis perspective, there really is no differentiation among these three terms due to the commonality of advantages, namely: small size, lower cost of ownership, enhanced electrical performance and reduced time to market.”
“High-density packages result in a smaller overall package when compared to packaged components performing the same function,” said Dr. Robert N. Castellano, president. “They are ideal for small portable devices such as cellphones, digital audio and Bluetooth-enabled products.”
The report projects 21% growth in 2006, to 1.8 billion units.
The HDP was dominated by the Communications sector in 2003, which held a 82.9% share, followed by the Consumer sector with an 11% share. These sectors are predicted to rise 76.4% and 18%, respectively, by 2008.
System-in Package (SiPs) represented 61.1% of the MCM-L market in 2003 but will grow to a 72.9% share in 2008.
“From a technical perspective there is indeed a difference between MCM, MCP and SiP in the incorporation of passive components,” added Dr. Castellano. “From a market analysis perspective, there really is no differentiation among these three terms due to the commonality of advantages, namely: small size, lower cost of ownership, enhanced electrical performance and reduced time to market.”
FRANKLIN, MA –Speedline Technologies’ recent award of seven new U.S. patents lifts the company’s total above 400, 150 of which are active. The company has another 90 patents pending.
The recently awarded patents involve:
* "Apparatus for Calibrating a Dispensing System"
* “Filtration of Flux Contaminants"
* "Needle Cleaning System"
* "Reflow Soldering Apparatus and Method for Selective Infrared Heating"
* "Selective Gas Knife for Wave Soldering"
* "System and Method for Controlling a Conveyor System Configuration to
Accommodate Different Size Substrates"
* "System and Method for Detecting Defects in Printed Solder Paste"
“At Speedline Technologies, ‘process knowledge leader’ is more than a positioning statement – it is our vision and passion,” said Dr. Gerald Pham-Van-Diep, director of advanced development. “But even more importantly, our commitment extends past the R&D process – through implementation.”
Patented Speedline innovations include: Look up and down vision probe technology; Parallel processing within the printer; Inspection techniques within printers and dispensers; Pressurized printing technologies; Accurate dispensing technologies; Reflow and flux management techniques; and Debridging techniques in wave soldering machines.
Speedline Technologies, speedlinetech.com
The recently awarded patents involve:
* "Apparatus for Calibrating a Dispensing System"
* “Filtration of Flux Contaminants"
* "Needle Cleaning System"
* "Reflow Soldering Apparatus and Method for Selective Infrared Heating"
* "Selective Gas Knife for Wave Soldering"
* "System and Method for Controlling a Conveyor System Configuration to
Accommodate Different Size Substrates"
* "System and Method for Detecting Defects in Printed Solder Paste"
“At Speedline Technologies, ‘process knowledge leader’ is more than a positioning statement – it is our vision and passion,” said Dr. Gerald Pham-Van-Diep, director of advanced development. “But even more importantly, our commitment extends past the R&D process – through implementation.”
Patented Speedline innovations include: Look up and down vision probe technology; Parallel processing within the printer; Inspection techniques within printers and dispensers; Pressurized printing technologies; Accurate dispensing technologies; Reflow and flux management techniques; and Debridging techniques in wave soldering machines.
Speedline Technologies, speedlinetech.com
Press Releases
- Altus Partners with Sellectronics to Enhance Manufacturing Capabilities with PVA Delta 8 System
- ITW EAE Celebrates Major Milestone in Domestic Manufacturing Expansion
- Micro Technology Services Selects PBT Works CompaCLEAN III for Advanced PCB Cleaning Performance
- Indium Corp. is Electrifying the Future with Advanced Materials Solutions at Productronica