caLogo

News

HERNDON, VA  — A set of recommendations issued today call for continued availability of tin-lead compatible components for products exempted from European restrictions. The International Electronics Manufacturing Initiative today said the measures are necessary in order to safeguard the dependability of high-reliability products as the supply chain converts to lead-free components and materials. 


Read more ...

BANNOCKBURN, ILThe July 90-day moving average shipments of all types of circuit boards rose 4.7% year-on-year, and bookings rose 4.1%, according to the latest poll of North American PCB fabricators.

A large percentage of the production includes boards built offshore and distributed by North American vendors. According to IPC, 32% of the shipments reported were produced offshore, up from 26% in June.

The domestic book-to-bill ratio rose 0.03 points to 1.16. The ratio is based on data collected by IPC from rigid and flex producers and is calculated by dividing three months worth of orders by sales. A ratio over 1.0 is considered an indicator of rising demand.

The ratio for rigid PCBs was down 0.02 to 0.99, while that of flexible circuits rose 0.20 points to 1.71.

Rigid board shipments, estimated by IPC to make up more than 75% of all domestic PCBs, were down 2.7% in July vs. a year ago. Bookings fell 11.9% during the month.

Flex sales rose 32.7% and bookings jumped 53.3%. Value-added services made up 56% of the shipment value of flex circuits.

“July is historically a slower month than June for PCB sales,” IPC said in a statement. “Yet the book-to-bill ratios for flexible circuits and combined PCBs continued to rise in July, due to the spike in flexible circuit bookings in June and the trend for flexible circuit bookings to outpace shipments substantially, which continued in July.” 

Year-to-date, rigid shipments are down 6.4% and bookings are off 3.8%. Flex bookings are up 16.1% and shipments are up 25.6%. Shipments of all boards are down 0.2% and bookings are up 0.1%.

Sequentially, combined shipments were down 16.4 over June, while bookings fell 27%. Rigid shipments were down 19.4% and bookings were off 19%. Flex shipments fell 6.7% and bookings were down 37.9% over June.

Sixty-eight percent of PCB shipments reported was domestically produced. Domestic production accounted for 81% of rigid PCB and 32% of flexible circuit shipments in July, IPC said.

In a statement, IPC cautioned that month-to-month comparisons should be made with caution as they may reflect cyclical effects.

 

DES PLAINES, IL — Kester will host a lead-free seminar, “Project 2005: Achieving Lead-free RoHS Assembly” on Sept. 13 at the Radisson Hotel Dallas in North Richardson, TX.
 
The seminar is designed to assist the electronic industry in the transition to lead-free soldering and RoHS compliancy.
 
Topics will include: lead-free and RoHS directive overview; supply changes and procurement issues; board/component requirements; lead-free alloy selection for SMT, wave and rework; lead-free wave, and SMT process optimization; impact of dual systems; BGA rework practices; hand soldering process changes; lead-free RoHS reliability; field rework and training; and training and documentation.
 
Attendees will receive a lead-free assembly technical manual and CD containing presentation materials; technical white papers; and the Lead-Free Connection.
 
For more information on the technical content of seminar, contact Peter Biocca:  pbiocca@kester.com.
For registration details, contact Theresa Rudnick: (847) 699-5580 or visit kester.com.
SAN JOSE, CA -- Venture Outsource Group is presenting a live Webcast on electronics outsourcing contracts. The event, Electronics Outsourcing Contracts – Development & Negotiations, will take place Oct. 4 at 8:00 a.m. PDT. 

The Webcast will be led by VOG president Mark Zetter. Registration and program information can be found at ventureoutsource.com/docs/webinar/contracts.html.
FRANKLIN, MASpeedline Technologies and Agilent Technologies have found that positional accuracy of a paste deposit relative to the pad is the critical element in ensuring good fine-pitch, lead-free assemblies, and is even more critical for some formulations than others.

 A report on the three-month investigation to understand and quantify variables in a lead-free manufacturing process will be presented at SMTA International in Chicago in September.

Read more ...
HERNDON, VA — Congressman Frank Wolf (R-VA), chairman of the House Appropriations Subcommittee on Science, State, Justice and Commerce, will deliver the opening remarks at iNEMI's Leadership Forum next month. The forum is intended to launch a coordinated initiative that will stimulate innovation and manufacturing research in electronics.   

Read more ...

Page 808 of 1006

Don't have an account yet? Register Now!

Sign in to your account