New Tripoli, PA -- The $3.4 billion dry etch market achieved a record growth rate of 89% in 2004, led by Lam Research and Applied Materials, according to a report by The Information Network.
"The 89% growth rate in 2004 topped the 85% growth achieved in 2000," noted Dr. Castellano, president. "Lam Research led the market after growing 91% in 2004. Applied Materials moved ahead of TEL into second place after growing 123%."
The Dielectric Etch sector grew 101% and achieved a 58% share of the market, followed by Polysilicon Etch, which grew 87% and held 30% of the market.
The Dielectric Etch sector grew 101% and achieved a 58% share of the market, followed by Polysilicon Etch, which grew 87% and held 30% of the market.
The dry etch market is earmarked to drop 10.2% in 2005 to $3.1 billion.
In the $340 million dry strip market, Mattson regained its lead after growing 132% in 2004. Novellus placed second. The dry strip market is projected to drop 7.8% in 2005.
FOREST GROVE, OR - Merix Corp. has agreed to buy Eastern Pacific Circuits Ltd. for $120 million cash. Merix said the acquisition of the Hong Kong-based PCB supplier includes earn-out consideration of up to $8M based on 2005 adjusted earnings before interest, taxes, depreciation and amortization (EBITDA).
Merix plans to finance the transaction, expected to close in June, with a combination of available cash and debt. Eastern Pacific has four manufacturing plants in southern China and one in Hong Kong. In 2004, Eastern Pacific's preliminary unaudited sales were $143M, with adjusted EBITDA of $14.1M.
Zurich, Switzerland -- DEK has signed a supply and license agreement for its VectorGuard stencil technology with Gemido, a France-based designer and manufacturer of machines for the electronics industry. Gemido will manufacture the stencils from foil blanks supplied by DEK and will also provide customers with VectorGuard frames.
Gemido will implement this agreement in France and the French part of Switzerland.The show is offered in conjunction with the JIEP (Japan Institute of Electronics Packaging) 2005 Microelectronics Show: "Discover the Next Generation Technologies on Electronics Packaging."
The two shows will feature 530 exhibiting companies with 1,531 booths, and the producers expect more than 100,000 global attendees during the three-day period.
Participants can attend three keynote sessions: professor Dr. Kenichi Ohmae of UCLA will address "The Next Global Stage - Challenges and Opportunities in our Borderless World;" Dr. Takeo Nakagawa, CEO of Fine Tech Corp., will talk about strategies for the future of manufacturing in Japan; and Dr. Tsugio Makimto, Sony's corporate advisor will address the role of electronics packaging in the paradigm shift era of electronics industry.
The concurrent Jisso (Advanced Electronics Packaging) Technology Symposium will offer technological sessions such as SiP/Multi Chip Package, Thin Wafer/Chip Packaging, High Frequency Packaging/New Substrate Materials, FPC, MEMS, Embedded Packaging Board and Opto-electronics Packaging technologies on the topics.Click here for early registration.