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ELK GROVE VILLAGE, IL, Dec. 22 -- SigmaTron International Inc. has received a key certification for building medical devices, the EMS firm said today.

The company's Fremont facility has been certified to 13485 quality standards for medical device quality systems. The standards are said to supplement ISO 9001 and 9002 standards.

The certification was conducted by Orion Registrar Inc., a quality and environmental systems registrar. 

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SAN JOSE, Dec. 27 -- Manufacturing will surge in China in the next three years, provided the nation isn't overcome by social and political issues, says a new report. Semiconductors, product assembly and design services will all share in the gains, says iSuppli (www.isuppli.com).

China's share of the global semiconductor market will grow 50% by 2008, rising to 22% from its current 14%, the firm says. Sales of manufactured products will also grow 50%, to $301 billion in 2008, various news reports quoted Byron Wu, China chief manager and senior analyst.

EMS revenues will more than double, going from $18 billion last year to $45 billion in 2008, good for a 28% global share, the report said. ODM revenues, another burgeoning segment, will grow to $108 billion, from $40 billion last year. By 2008 China will have 75% of the global ODM market, iSuppli said.

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FRAMINGHAM, MA, Dec. 27 -- Digitization of media, expansion of broadband options, proliferation of new converged devices, and collision and consolidation of market leaders will define the top consumer trends in 2005, says a new report.

Accrding to market researchers IDC, 2005 will be a huge year for handheld game consoles and other portable gaming devices. The firm lists Sony's new PSP handheld gaming device and Nintendo's DS as standouts.

The firm also forecasts continued broadband adoption and VoIP.

HDD-based, portable MP3 players will see strong growth. Portable media players, however, will disappoint.

Digital camera shipments will exceed 80 million units, pushing conventional film cameras out. Winners will be Canon and Olympus, at the expense of most consumer electronics vendors -- Samsung, Panasonic and Casio -- and IT vendors -- HP, Gateway, Epson, Creative Labs and Logitech. (Sony, as a digital camera leader, is the consumer electronics exception, IDC says.)

IP video is a hot topic, but rollouts will be minimal in 2005. IP video efforts and offerings are expected to remain largely on the fringes in many regions, says IDC.

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BOSTON, Dec. 28 -- DEK has shipped company record 75,000 stencils this year, the company said today.

"Over the last 4 years, DEK has made significant investments in our logistics infrastructure, manufacturing capabilities and product R&D," says Michael Brianda, European general manager for DEK process support products. "It is very gratifying to see the fruits of our efforts - the 75,000th stencil shipment of 2004."

DEK manufactures a range of stencils and screens for electronics assembly.

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UP Media Group Inc. (Atlanta, GA) recently announced the winners of the Circuits Assembly 2004 Service Excellence Awards (SEAs) for Electronics Manufacturing Services (EMS) Providers and Electronics Assembly Equipment, Materials and Software Suppliers.

Participating companies' customers rated each company on a scale of 1 (poor) to 5 (superior) in five service categories: dependability/timely delivery, manufacturing quality, responsiveness to requests and changes, technology and value for the price.

From a part of each participant's entry fee, a generous donation of $5,000 was made on the their behalf to the Surface Mount Technology Association (SMTA, Minneapolis, MN) Charles Hutchins Educational Grant. In turn, the $5,000 grant is awarded annually to a graduate-level student pursuing a degree and working on thesis research in electronic assembly, electronics packaging or a related field.

Established in 1997 in memory of past SMTA president and industry colleague Charles Hutchins, the grant is intended for the purchase of technical books and research materials and for participation in conferences related to electronics assembly and packaging, and donations are recognized throughout the year.

For more information on past recipients, current donors and student submissions, and for making donations securely on-line, visit http://www.smta.org/hutchins/hutchins.cfm.

Cosponsored by Circuits Assembly magazine, the Hutchins Grant is awarded each year at the SMTA Annual Meeting during the SMTA International Conference.

www.smta.org

www.upmediagroup.com

Copyright 2004, UP Media Group. All rights reserved.

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NEPCON Shanghai/Electronics Manufacturing Technology China (EMT China) will be held April 26-29 at the Shanghai Everbright Convention & Exhibition Centre. The Surface Mount Technology Association (SMTA) and the Electronics & Information Industry Sub-Council (CCPIT) of China are co-organizing the high-level surface-mount technology conference.

This year's program will consist of a keynote, technical sessions on lead-free technology and 0201 assembly and two half-day training courses on lead-free systems by industry expert and past SMTA president Dr. Jennie S. Hwang, H-Technologies Group Inc.

The Keynote and technical presentations will be given by the Ministry of Information Industry, Gartner Dataquest, Flextronics International, Indium Corp., ERSA, HITACHI, Kingston Technology Co., EKRA, Daiichi Jisugyo, Fuji, OK Interenational, Siemens Dematic and Solectron.

The first training course, Interconnection Technology and Printed Circuit Board (PCB) Surface Finish and Component Coating is intended to provide broad-based information that enhances technology foundation in preparation for lead-free implementation. The presentation will be comprised of two parts: the first will cover lead-free solder interconnections and the second will address the properties and performance of lead-free PCB surface finishes and the component lead coatings.

The second course, Manufacturing Implementation, will focus on achieving yield, quality and reliability. The course will examine the key process modules, including solder paste printing and reflow, and the system compatibility between the BGA/CSP solder sphere, assembly solder paste, component coating and PCB substrate surface finish.

http://www.smta.org/education/symposia/symposia.cfm#nepcon_shanghai

Copyright 2004, UP Media Group. All rights reserved.

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