News
ROUND ROCK, TX – Michael Dell, the founder of Dell Computer,
today said the computer and consumer electronics maker would offer free
recycling of Dell-branded products worldwide.
"We have a responsibility to our customers to recycle the products we make and sell," said Dell, who is chairman of the company. "Our direct relationships with consumers allow us to offer this easy and free service and we encourage others in our industry to do so as well."
"We don’t believe consumers should have to pay for responsible retirement of products,” Dell said.
"We have a responsibility to our customers to recycle the products we make and sell," said Dell, who is chairman of the company. "Our direct relationships with consumers allow us to offer this easy and free service and we encourage others in our industry to do so as well."
"We don’t believe consumers should have to pay for responsible retirement of products,” Dell said.
ELKHART, IN -- Electronics manufacturer CTS Corp. said today it entered into an bank agreement providing it with a $100 million unsecured revolving credit facility through June 2011.
The company, which makes parts for medical and automotive customers and performs some contract electronics assembly, said it will also have access to an additional $50 million.
CTS said it plans to use the loan for general corporate purposes, including strategic acquisitions.
CTS customers include Hewlett-Packard and Motorola.
The company, which makes parts for medical and automotive customers and performs some contract electronics assembly, said it will also have access to an additional $50 million.
CTS said it plans to use the loan for general corporate purposes, including strategic acquisitions.
CTS customers include Hewlett-Packard and Motorola.
BANNOCKBURN, IL -- May sales of rigid printed circuit boards by North American fabricators were up 20.2% and bookings climbed 7.1% year-over-year, the IPC trade group reported Wednesday. Sequentially, shipments rose 8.5% and bookings were up 2.9%.
Flexible circuit shipments fell 4.2% and bookings were off 20% compared to May 2005. Shipments rose 19.5% and flex bookings increased 19.2% over April's numbers.
The May book-to-bill ratio for rigid boards fell to 1.02. The flexible circuit book-to-bill ratio was 0.91, its third straight month below the benchmark 1.0 level.
The ratios are based on monthly data collected from PCB producers that participate in IPC’s monthly PCB Statistical Program. The combined (rigid and flex) industry book-to-bill ratio in May was 1.01.
Ratios are calculated by dividing the value of orders over the past three months by the value of sales. A ratio of more than 1.0 suggests expansion.
It is difficult to derive the value of the IPC data, critics contend, because of the limited number and size of companies that participate in the survey.
Year to date, rigid PCB shipments are up 11.1% and bookings are up 12.8%. Flexible shipments are up 0.8 % and bookings are down 14.5%. Combined industry shipments are up 10.3% and bookings are up 10.8%.
More than 75% of the PCB market in North America is for rigid boards.
At least 13% of the boards sold in May by those surveyed were built offshore.
Flexible circuit shipments fell 4.2% and bookings were off 20% compared to May 2005. Shipments rose 19.5% and flex bookings increased 19.2% over April's numbers.
The May book-to-bill ratio for rigid boards fell to 1.02. The flexible circuit book-to-bill ratio was 0.91, its third straight month below the benchmark 1.0 level.
The ratios are based on monthly data collected from PCB producers that participate in IPC’s monthly PCB Statistical Program. The combined (rigid and flex) industry book-to-bill ratio in May was 1.01.
Ratios are calculated by dividing the value of orders over the past three months by the value of sales. A ratio of more than 1.0 suggests expansion.
It is difficult to derive the value of the IPC data, critics contend, because of the limited number and size of companies that participate in the survey.
Year to date, rigid PCB shipments are up 11.1% and bookings are up 12.8%. Flexible shipments are up 0.8 % and bookings are down 14.5%. Combined industry shipments are up 10.3% and bookings are up 10.8%.
More than 75% of the PCB market in North America is for rigid boards.
At least 13% of the boards sold in May by those surveyed were built offshore.
Clinton, NY -- Indium Corp.’s vice president of technology, Dr. Ning-Cheng Lee, has been appointed to the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society Board of Governors.
Dr. Lee was named SMTA Member of Distinction in 2002, received the Soldertec Global Lead-Free Solder Award in 2003 and recently received the 2006 CPMT Exceptional Technical Achievement Award. He has also served as an SMTA board member, liaison to the Taiwan SMTA chapter, coordinator and chair of the 2005 Nepcon Shanghai technical program, and is author of two books and over 100 technical papers.
He has experience in the development of solders, fluxes, high-temperature polymers, encapsulates for microelectronics, underfills and adhesives. His current research interests cover advanced materials for interconnects, and packaging for electronics and optoelectronics applications, with emphasis on high performance and low-cost ownership.
RENTON, WA – Microscan is offering a free downloadable series of educational tutorials on Data Matrix symbol verification. Designed for any manufacturer who marks parts with Data Matrix, the series covers the major industry verification standards involved in determining symbol quality. They also provide information on quality parameters and how they affect the symbol grading process.
“Open source manufacturers are increasingly required to supply traceable parts and components using Data Matrix symbols,” said Matt Allen, product manager. “In any bar code application, reliable traceability begins with marking the highest quality symbol possible for that application. General education on the parameters that define a high quality symbol will solve most application challenges before they occur. The verification educational series will provide manufacturers with the knowledge and the tools they need to be successful from the start.”
Located at microscan.com/elearning, the tutorials are available in a series of downloadable multi-media presentations, or on CD-ROM by request.
Minneapolis, MN -- The SMTA is again co-locating SMTA International with the Assembly Tech Expo this September in Rosemont, IL. The program will consist of over 100 technical papers, 26 tutorials and special symposiums on Contract Manufacturing, Staying Competitive and Lead-Free Soldering Technology, as well as various free events.
The technical sessions are organized into tracks on Manufacturing and Assembly, Advanced Packaging, Substrates, RoHS, and Process Control.
Full- and half-day educational courses will focus on Manufacturing and Assembly, Advanced Packaging, Substrates, Soldering, Test/Inspection/Quality, and Process Control.
The Emerging Technologies Summit will feature sessions on Packaging Space: Nano to Outer, Wireless Technology and Using RFID to Add Value to Your Products and Services. It will conclude with an Emerging Technologies Panel.
The Contract Manufacturing Symposium will consist of two paper sessions: Exploring the Dollars and Sense of EMS and EMS Program Management. The Lead-free Symposium will feature paper sessions on the Joint Council on Aging Aircraft/ Joint Group on Pollution Prevention Lead-Free Solder Project, Lead-Free Manufacturing Experiences and Lead-Free Industry Standards, Lead-Free Fatigue, and Accelerated Life Testing for Lead-Free Solder Joints.
A new Symposium on Staying Competitive in the Global Market will address how to improve your competitive position in your market. The emphasis is on North American issues related to cost, productivity, automation, finance and quality.
Free events include:
The Opening session: What’s Next? Global RoHS and Emerging Technologies
Future Directions for Packaging
NPI and Rapid Setup Aid time to Market
iNEMI Roadmaps
Standards Update
Emerging Technologies
Selecting the Right Lead-Free Cleaning Process
Problem Solving and Reliability Modeling
The conference will include a full day workshop, “Beyond RoHS and WEEE: Preparing for the Energy-Using Products (EuP) Directive & Design for Environment,” co-sponsored by the SMTA, Technology Forecasters and The GoodBye Chain Group.
The technical sessions are organized into tracks on Manufacturing and Assembly, Advanced Packaging, Substrates, RoHS, and Process Control.
Full- and half-day educational courses will focus on Manufacturing and Assembly, Advanced Packaging, Substrates, Soldering, Test/Inspection/Quality, and Process Control.
The Emerging Technologies Summit will feature sessions on Packaging Space: Nano to Outer, Wireless Technology and Using RFID to Add Value to Your Products and Services. It will conclude with an Emerging Technologies Panel.
The Contract Manufacturing Symposium will consist of two paper sessions: Exploring the Dollars and Sense of EMS and EMS Program Management. The Lead-free Symposium will feature paper sessions on the Joint Council on Aging Aircraft/ Joint Group on Pollution Prevention Lead-Free Solder Project, Lead-Free Manufacturing Experiences and Lead-Free Industry Standards, Lead-Free Fatigue, and Accelerated Life Testing for Lead-Free Solder Joints.
A new Symposium on Staying Competitive in the Global Market will address how to improve your competitive position in your market. The emphasis is on North American issues related to cost, productivity, automation, finance and quality.
Free events include:
The Opening session: What’s Next? Global RoHS and Emerging Technologies
Future Directions for Packaging
NPI and Rapid Setup Aid time to Market
iNEMI Roadmaps
Standards Update
Emerging Technologies
Selecting the Right Lead-Free Cleaning Process
Problem Solving and Reliability Modeling
The conference will include a full day workshop, “Beyond RoHS and WEEE: Preparing for the Energy-Using Products (EuP) Directive & Design for Environment,” co-sponsored by the SMTA, Technology Forecasters and The GoodBye Chain Group.
For details and to register, visit www.smta.org/smtai .
Press Releases
- Altus Partners with Sellectronics to Enhance Manufacturing Capabilities with PVA Delta 8 System
- ITW EAE Celebrates Major Milestone in Domestic Manufacturing Expansion
- Micro Technology Services Selects PBT Works CompaCLEAN III for Advanced PCB Cleaning Performance
- Indium Corp. is Electrifying the Future with Advanced Materials Solutions at Productronica