JERSEY CITY, NJ – Cookson Electronics has announced a surcharge on Alpha brand Sn-bearing solder pastes, effective 30 days from customer notification. A global shortfall in tin supplies versus forecasted consumption has pushed prices to 19-year highs. Tin prices have increased from a range of $6,000 to $9,000/metric ton during 2006 to more than $14,000/metric ton this quarter. Cookson said it would eliminate the surcharges when prices return to mid-2006 levels.

BANNOCKBURN, IL - The revision of a standard on halogenated flame-retardant use is ready for industry comment. IPC invites all interested parties to submit comments on the final draft of IPC-WP/TR-584A, “Halogenated Flame Retardants in Printed Circuit Boards and Assemblies (Correcting the Misunderstandings on ‘Halogen-Free’).” A PDF is available; contact Tom Newton at TomNewton@ipc.org. The comment period closes April 30.    

SAN FRANCISCO – The nation’s CIOs expect IT budgets to grow 5.1% during the next 12 months, down from 5.8% in December. The weaker results reflect increased caution across most product categories, although a rebound in large enterprise spending is expected, says Deutsche Bank Equity Research. DB’s March poll revealed a slow start to 2007, although results for very large (>5,000 employees) and small firms (101-500) strengthened in March, with CIOs expecting growth of 7% and 10%, respectively, in the next 12 months (vs. 3% and 7% in December).

COLORADO SPRINGS – IC Interconnect, a wafer bumping company, was named sole North American representative for Jiangyin Changdian Advanced Packaging, a provider of bumping technologies. The agreement establishes ICI/jcap International, the marketing, sales, engineering and customer support arm of JCAP in North America. Under the agreement IC Interconnect can install and operate its electroless nickel UBM process at a plant in China.