The AG16xFNxx Series power MOSFETs are designed for automotive 48V power supply systems, offering an 80V rating for applications including inverter control circuits, electric motors and electric water pumps. Available in compact HPLF5060 and DFN3333 packages, the devices are engineered to reduce board space requirements compared with conventional automotive MOSFET packages. The MOSFETs incorporate Copper Clip Junction Technology to improve heat dissipation and support high-current operation. The HPLF5060 package features Gull-Wing leads, while the DFN3333 package incorporates Wettable Flank Technology to enhance PCB solder joint inspection and reliability. All devices are AEC-Q101 qualified for automotive applications.
The IHDV Series power inductors are designed for automotive, energy and industrial applications requiring isolation voltages up to 1.5kV. Available in automotive-qualified and commercial versions, the devices feature powdered iron alloy cores for soft saturation characteristics and support continuous operation at temperatures up to 180°C. Offered in 0808 and 1008 case sizes, the inductors are engineered for onboard chargers, battery charging circuits, power factor correction and high-voltage DC battery filtering. The automotive versions are AEC-Q200 qualified, while all models are RoHS-compliant, halogen-free and include support pins for enhanced shock and vibration resistance.
The TruView Prime SDX combines 2D X-ray, 2.5D imaging and SDX Planar CT capabilities in a benchtop platform designed for electronics manufacturing inspection. Features a fully viewable 20" × 20" inspection area and is engineered to inspect large BGAs, stacked packages, bottom-terminated components and other complex assemblies. AI-powered analysis tools automatically measure solder quality metrics, including BGA and pad voiding, helping improve inspection consistency and reduce operator variability. Designed for quality control, process development and failure analysis, the platform enables users to perform planar CT scans in three steps and save inspection parameters for repeatable workflows.
The Vision AI Label Reader automates label inspection, identification and data capture for goods-in and logistics operations. Designed to process a wide variety of label formats, languages and code types, the system uses AI-based image analysis to extract and interpret printed text, 1D and 2D codes, and handwritten information without requiring predefined label templates. Powered by an IDS uEye CP industrial camera, the solution is engineered to handle reflective packaging, damaged codes and varying lighting conditions while providing structured data output for ERP integration. Supports automated validation, traceability and inventory management workflows, helping manufacturers improve data quality and accelerate receiving operations.
The Decode API provides automated analysis of PCB design and manufacturing data for integration into quoting, ERP and customer-facing workflows. Processes design packages to extract fabrication information, including stackups, board dimensions, drill data and DFM results from Gerber and ODB++ files, while also supporting BOM analysis, component sourcing, assembly planning and pricing. The API returns structured data covering PCB fabrication, assembly requirements and turnkey manufacturing estimates. Additional capabilities include integrated SpeedDFM analysis, version-controlled JSON schema support, BOM sourcing automation and assembly planning tools designed to streamline quoting and manufacturing workflows.
The RNCQ Series thin film chip resistor is designed for RF and microwave circuits operating at frequencies up to 50GHz. Built on a high-purity substrate using advanced thin film technology, the resistor is engineered to provide stable electrical performance in high-frequency applications. Provides impedance-versus-frequency curves for common package sizes and resistance values, as well as S-parameter data for insertion loss and reflection loss. The RNCQ Series is suited for RF and microwave communications, 5G infrastructure, satellite communications and precision test equipment.