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PEACHTREE CITY, GA – OCTOBER 11, 2025 – Attendance at the PCB West 2025 conference and exhibition held in the Silicon Valley this month grew 3.5% year-over-year, the Printed Circuit Engineering Association (PCEA) announced today. The figures include attendance for both the exhibition on October 1 and the four-day conference held September 30 to October 3.

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FOUNTAIN INN, SC – Kyocera AVX has unveiled its new KGP Series commercial-grade stacked multilayer ceramic capacitors (MLCCs), engineered to deliver higher capacitance values in a compact footprint for high-frequency applications. Designed to support miniaturization and sustainability trends, the series eliminates lead and cadmium, ensuring compliance with environmental standards while maintaining low ESR and ESL to minimize noise and optimize performance.

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GURUGRAM, INDIA – VVDN Technologies is preparing for an Initial Public Offering once its annualized revenue reaches $1 billion, according to cofounder Vivek Bansal. The Gurugram-based design-led electronics manufacturer is expanding its global footprint with new production facilities in the UAE and the US to navigate tariffs and meet local sourcing demands.

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Elgin, IL – 9/22/2025 – Precision Technologies Inc., doing business as Precision PCB, a One-Stop PCB Fabrication and Assembly services company with 27 years of experience providing Quality, Reliability and Excellence in customer service, has acquired the assets of Microplace, Inc. This strategic acquisition enhances Precision PCB's capabilities in assembly, strengthens its technical expertise, and expands the value delivered to customers.

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NEEDHAM, MA – Global PC shipments accelerated in the third quarter, rising 9.4% compared to the same period a year earlier, according to preliminary data from International Data Corporation. The total of 75.8 million units reflects a steady refresh of aging hardware as Windows 11 adoption continues to shape replacement cycles.

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PHOENIX – Global investment in 300mm fab equipment is set to total $374 billion from 2026 to 2028, according to SEMI’s latest 300mm Fab Outlook. The ramp is fueled by AI chip demand for data centers and edge devices, along with policy-backed regionalization and supply-chain restructuring aimed at greater self-sufficiency. SEMI expects this year to be the first year 300mm spending tops $100 billion, rising 7% to $107 billion, with further gains to $116 billion in 2026, $120 billion in 2027, and a jump to $138 billion in 2028.

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