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DEFECT OF THE MONTH
Solder balling and incomplete reflow when reflowing through-hole components with pin-in-paste.
Bob Willis
FT. LAUDERDALE, FL – Element Solutions today announced a prize competition aimed at students in metal coatings science.
ARLINGTON, VA -- US Defense Advanced Research Projects Agency (DARPA) has awarded contracts worth some $1.2 million to Raytheon and BAE Systems develop optical interconnects for next-generation multichip modules.
CYPRESS, CA ― July 2019 ― Metcal today announced plans to exhibit at the SMTA Heartland Expo & Tech Forum, scheduled to take place Thursday, July 18, 2019 at the Marriott Kansas City Overland Park in Kansas.
Press Releases
- NEOTech Significantly Improves Wire Bond Pull Test Process
- Sat Nusapersada Chooses Siemens' Process Preparation Software to Boost NPI and SMT Line Efficiency
- SIA Praises Finalization of CHIPS Investments for GlobalFoundries Manufacturing Projects
- KYZEN to Spotlight KYZEN E5631, AQUANOX A4618 and Process Control at SMTA Silicon Valley Expo and Tech Forum