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TORONTO – EMS provider SMTC Corp. reported revenue of $66.1 million for the second quarter, an increase of 8% year-over-year.
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HAVERHILL, MA – Engineering firm DKN Research has developed the film base connector, the construction of which is built on a thin plastic film. It was developed for use as a high-density termination technology for flexible circuits, the company reports.
 
Micro bump arrays and soldering pads are built on thin heat-resistant film in this connector. The connectors are soldered on SMT boards, and flexible circuits with size hole arrays are placed on the connectors. The micro bump arrays make reliable connections to the flexible circuits, says DKN.
 
The connection spaces with a film base connector will be one order smaller compared to traditional connectors, the company adds. The heights of the connections can be smaller than 0.3 mm, including flexible circuits. A 6 x 10 array connector makes 60 reliable connections for finer flexible circuits than 100-µm pitches, and consumes 24 sq. millimeters for the 60 pin connections on the boards, DKN states.

Film base connectors are produced through a photolithography process. A design for the connectors will realize a high-density connection for 50-µm pitch flexible circuits in a small space, the company says.
 
A 1000-pin count connection in 10-mm square reportedly could be practical. Another big advantage for this connector device is repeated connections can be made where they cannot be made using other high-density termination technologies such as wire bonding and ACF connection, the company says.
 
DKN expect more capabilities from the termination technology because of the broad freedom of its construction. Exchangeable MCM packages, replaceable, stacked IC packages, and multi-layer rigid/flex are future goals for the company.
 
DKN has prepared a basic design guide explaining how to use the film base connectors with high-density flexible circuits.  For more information, visit http://www.dknresearch.com/0707NewsFilmConEng.pdf
COLORADO SPRINGS, CO -- Speedline Technologies executive Keith Favre has been named president and chief executive of PhotoStencil, Circuits Assembly has learned. Favre will assume his new duties next week.
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TAIPEIDelta Electronics Inc. announced its net revenues for July hit a record high of $11.1 million, a 27% increase year-over-year, and a 4% increase from June.

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EL SEGUNDO, CA – Booming sales of digital televisions during the coming years will yield huge opportunities for semiconductor suppliers, with revenue from shipments of chips for this segment expected to double between 2006 to 2011, iSuppli Corp. predicts.

The global digital TV semiconductor market revenue will rise to $14.2 billion in 2011, expanding from $7.1 billion in 2006, says the research firm.
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ROME, NY – The ESDA is requesting two-page abstracts for the International Electrostatic Discharge Workshop, taking place May 12-15 in Port D-Albret, France.
 
Presentations should address novel design concepts; special custom design approaches; technology integration issues; failure analysis; test structures; simulation tools; component-level ESD testing; ESD characterization; system-level ESD issues; immunity of ICs to EMI, and unresolved ESD issues.
 
Abstracts should be sent as PDFs to iew@esda.org no later than Nov. 26, and should include the title, author’s name and author’s affiliation. 
 
The technical program committee will announce selections on or before Jan. 7.

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