TAMPERE, FINLAND – The first system on chip developed by the Finnish SoC Hub consortium has been taped out. The project partners will focus next on improving the design, automation and performance of the SoC. The chip will be ready for deployment in early 2022. The Ballast chip is the first in a series of three chips. TSMC will manufacture it.

TOULOUSE, FRANCE – Latécoère has entered into a definitive agreement to acquire electronics manufacturer Malaga Aerospace, Defense & Electronics Systems for an undisclosed sum.

STOCKHOLM – Note said the company's fourth quarter sales are expected to be at least SEK 745 million (US$81.8 million), growth of at least 60%.

SCOTTSDALE, AZ – Semiconductor growth will climb 11% in 2022, following a 26% jump in 2021, IC Insights said. After its highest growth rate since 2010, 2022 will more inline with 2020, when IC sales rose 13%.