News
STAMFORD, CT – Gartner Inc. lowered its capital equipment spending forecasts for 2007 and 2008. Overall capital spending is projected to hit $55.2 billion in 2007, down 1.5% year-over-year. In 2008, capital spending is projected to grow 10.7% to $61.1 billion, said the research firm.
Worldwide semiconductor capital equipment spending is forecast to total $40.6 billion in 2007, a 3.2% decline from 2006. The market is expected to rebound in 2008, with spending expected to reach $46.7 billion, a 14.9% increase, said Gartner. This is below its previous forecast at the end of 2006.
After growing more than 18% in 2006, packaging and assembly equipment market revenue is projected to decline 12.2% in 2007, but will grow 20.2% in 2008. ATE sales will slow in 2007, with an expected decline of 11.2% for the year, the firm said.
TAIPEI — Foxconn has purchased 142 placement machines from Sony Taiwan, according to a company filing on the Taiwan Stock Exchange.
The capital investment, worth a total of US$16.58 million, was negotiated between Nov. 16, 2006 and Apr. 19, 2007, the filing said.
The capital investment, worth a total of US$16.58 million, was negotiated between Nov. 16, 2006 and Apr. 19, 2007, the filing said.
RESEARCH TRIANGLE PARK, NC – Top-five PC maker Lenovo will lay off 650 workers and move 750 jobs closer to the company’s suppliers and manufacturing operations. The company will take a pretax restructuring charge of $50 million to $60 million, most in the current quarter.
The move will save the former IBM PC unit about $100 million in the current fiscal year. The 1,400 positions represent about 5% of its global workforce, and Lenovo expects to complete most of the changes in the next 12 months.
The move will save the former IBM PC unit about $100 million in the current fiscal year. The 1,400 positions represent about 5% of its global workforce, and Lenovo expects to complete most of the changes in the next 12 months.
BOSTON – Transit times from Asia are leveling as the region is reporting typical, slow market conditions characterized by adequate space to meet demand and stable rates, says Trans Global Logistics in a recent update. Airfreight demand in May will pick up, the logistics provider said.
Southeast Asia experienced strong demand for airlift late last month; transit times were longer because of congestion at regional air hubs. A number of carriers have imposed fuel surcharge increases, and TGL expect more increases this month.
While May demand will rise, adequate capacity should keep transit times and rates in line. The weeklong Labor Day Golden Week holiday starts May 1. Factories close for the week and, as a result, the company expects a surge of air shipments before the holiday.
Southeast Asia experienced strong demand for airlift late last month; transit times were longer because of congestion at regional air hubs. A number of carriers have imposed fuel surcharge increases, and TGL expect more increases this month.
While May demand will rise, adequate capacity should keep transit times and rates in line. The weeklong Labor Day Golden Week holiday starts May 1. Factories close for the week and, as a result, the company expects a surge of air shipments before the holiday.
SALT LAKE CITY – CirTran Corp., an EMS builder of consumer electronics products, today guided for a 114% hike in first quarter sales.
The company anticipates sales of approximately $3.7 million for the first quarter, an increase of approximately $2 million over last year.
The company anticipates sales of approximately $3.7 million for the first quarter, an increase of approximately $2 million over last year.
WASHINGTON – Congress this week introduced into legislation The Patent Reform Act of 2007, a bill aimed at helping the filing process and to ease the financial burden to companies that infringe on existing patents.
The Senate bill is cosponsored by Patrick Leahy (D-VT) and Orrin Hatch (R-UT), while the House version is cosponsored by Howard Berman (D-CA) and Lamar Smith (R-TX).
The reform includes provisions to “balance” awards for damages, limiting them to only economic value of the improvement; establish fair standards for punitive damages; restrict forum shopping, and improve patent quality. In addition, the bill would create a “first-to-file” system (the American system is the only one in the world that still grants patents to the first inventor rather than the first to file an application); according to patentlyo.com, the bill makes it easier to file a patent application without the inventor's cooperation. Leahy says the bill creates a more streamlined and effective way of challenging the validity and enforceability of patents. He also claims, “American IP industries account for over half of all U.S. exports, represent 40 percent of our economic growth and employ 18 million Americans,” which makes strengthening intellectual property that much more important to economic growth.
To view the document, visit
http://www.thefireofgenius.com/wp-content/uploads/2007/04/coe07702_xml.pdf.
The Senate bill is cosponsored by Patrick Leahy (D-VT) and Orrin Hatch (R-UT), while the House version is cosponsored by Howard Berman (D-CA) and Lamar Smith (R-TX).
The reform includes provisions to “balance” awards for damages, limiting them to only economic value of the improvement; establish fair standards for punitive damages; restrict forum shopping, and improve patent quality. In addition, the bill would create a “first-to-file” system (the American system is the only one in the world that still grants patents to the first inventor rather than the first to file an application); according to patentlyo.com, the bill makes it easier to file a patent application without the inventor's cooperation. Leahy says the bill creates a more streamlined and effective way of challenging the validity and enforceability of patents. He also claims, “American IP industries account for over half of all U.S. exports, represent 40 percent of our economic growth and employ 18 million Americans,” which makes strengthening intellectual property that much more important to economic growth.
To view the document, visit
http://www.thefireofgenius.com/wp-content/uploads/2007/04/coe07702_xml.pdf.
Press Releases
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- ASMPT and IBM Deepen Collaboration to Advance Bonding Methods for Chiplet Packages for AI
- Murray Percival Company Expands Product Line with Representation of BIMOS ESD Seating in the Midwest
- Selectronic Assembly Welcomes Eliud Herrera as Production Manager