News
DUNFERMLINE, SCOTLAND -- The Simclar Group has closed a pair of manufacturing sites in Scotland due to slowing demand, according to several news reports. The EMS company said facilities in Irvine and Kilwinning would be shuttered and a total of 420 employees laid off.
SAN JOSE -- Sanmina-SCI today reported December quarter revenue of $2.78 billion, down 2.8% year-over-year and up 2.2% sequentially.
The results were in line with Sanmina's previous guidance of $2.70 billion to $2.85 billion.
The results were in line with Sanmina's previous guidance of $2.70 billion to $2.85 billion.
IRONWOOD, MI -- Burton Industries has received ITM Process Certification and ITM Lead-Free Capability Certification for its Ironwood SMT assembly facility.
Based on audits of the company's operations, processes, materials and personnel, ITM Consulting
said the plant meets the standards set forth by ITM and represent best practices for manufacture and assembly.
ITM further determined and certified that Burton Industries’ Ironwood facility is capable of producing Pb-free assemblies in compliance with the requirements of the RoHS Directive.
As part of the certification process, ITM performs a patented SMT assembly process audit which includes Pb-free process capability. Materials, equipment, documentation, processes and methodologies are all scrutinized. When recommendations of the initial gap analysis audit are fulfilled, a second audit is performed and first Pb-free build is observed. Samples of the first build are sent to an independent analysis laboratory.
Based on audits of the company's operations, processes, materials and personnel, ITM Consulting
said the plant meets the standards set forth by ITM and represent best practices for manufacture and assembly.
ITM further determined and certified that Burton Industries’ Ironwood facility is capable of producing Pb-free assemblies in compliance with the requirements of the RoHS Directive.
As part of the certification process, ITM performs a patented SMT assembly process audit which includes Pb-free process capability. Materials, equipment, documentation, processes and methodologies are all scrutinized. When recommendations of the initial gap analysis audit are fulfilled, a second audit is performed and first Pb-free build is observed. Samples of the first build are sent to an independent analysis laboratory.
THIEF RIVER FALLS, MN – Digi-Key has signed an agreement to distribute Fotofab’s precision metal parts worldwide. The deal covers RF shields, crystal modular mask systems and electronic packaging lids.
Separately, Digi-Key also agreed to distribute China-based IRTOUCH Systems’ touch screens.
Separately, Digi-Key also agreed to distribute China-based IRTOUCH Systems’ touch screens.
ATLANTA, GA – UP Media Group announced that Henry Potts, vice president and general manager of the Systems Design Division of Mentor Graphics Corp., will deliver the keynote at PCB Design Conference West on Mar. 27 in Santa Clara, CA.
Cross Currents: Where PCB Design Meets ICs and Hardware will focus on trends for company and market globalization, outsourcing, and manufacturing technologies. Potts will cite examples of how the EDA industry is developing technologies to meet these challenges, and specific examples of future development directions both within the PCB design space and extended to IC-to-PCB and electro-mechanical design team collaboration.
To register for PCB West, or find out more about the show, visit http://www.pcbwest.com.
Cross Currents: Where PCB Design Meets ICs and Hardware will focus on trends for company and market globalization, outsourcing, and manufacturing technologies. Potts will cite examples of how the EDA industry is developing technologies to meet these challenges, and specific examples of future development directions both within the PCB design space and extended to IC-to-PCB and electro-mechanical design team collaboration.
To register for PCB West, or find out more about the show, visit http://www.pcbwest.com.
MUNICH - Siemens will acquire industrial software supplier UGS for $3.5 billion from private equity investors Bain Capital, Silver Lake Partners and Warburg Pincus. The deal is subject to approval.
Press Releases
- SIA Applauds CHIPS Act Incentives for Amkor Facility in Arizona
- ASMPT and IBM Deepen Collaboration to Advance Bonding Methods for Chiplet Packages for AI
- Murray Percival Company Expands Product Line with Representation of BIMOS ESD Seating in the Midwest
- Selectronic Assembly Welcomes Eliud Herrera as Production Manager