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SAN CLEMENTE, CA – Inspection equipment OEM YESTech has sold its 500th AOI system, the company announced today. Panasonic purchased the system for its Reynosa, Mexico, plant. Panasonic first purchased YESTech’s AOI in 2005.
 
SAN JOSE – The SMTA announced plans for the 4th Annual International Wafer-Level Packaging Conference and Exhibition.
 
This event will be held Sept. 18-19 in San Jose, and will focus on leading-edge IC packaging and test technologies with special emphasis on 3-D stacked packaging.
 
The event includes one day of workshops, a two-day technical program and two days of exhibits.
 
Submit 200-word abstracts to Melissa Serres at melissa@smta.org by March 23.
SONORA, MEXICOIndium announced signed an agreement with Multi Dicona to distribute soldering materials in Sonora, Mexico.

The deal covers Indium’s solder paste, rework flux, wave solder fluxes, liquid fluxes, solder bar, solid and flux cored wire, and tape and reel preforms.

Multi Dicona has more than 13 years’ experience in the printed circuit board industry and is working toward ISO 9000 certification.  
 
 
 
ROME, NYThe Electrostatic Discharge Association (ESDA) has conferred program manager certification status on seven individuals. The program certifies the expertise of individuals involved in designing, implementing, managing and auditing ESD control programs.
 
Gaining certification were Dale Fuller, Brad Klepsa, Marcus Koh, Jim Krzmarzick, Jeff Salisbury, Keith Smith and Luis Velazquez.
 
The test was developed and graded by the Program Manager Certification Council.
 
ESDA will host the first annual Device Design Certification Exam in September during the association’s 2007 EOS/ESD Symposium in Anaheim, CA. Details regarding the exam are available at www.esda.org/devicedesign.html.
TORONTO  – The SMTA-produced International Conference on Soldering and Reliability will be held April 17-19 in Toronto.
 
Topics to be covered include SnPb with lead-free components; reliability; harsh environment; tin whiskers; new alloys; electromigration; thermal dissipation; manufacturing process; supply chain issues; advanced packaging; new substrate materials; surface finishes; thermal interface materials, and underfill.

To present, please submit a 200- to 300-word abstract to Melissa Serres at melissa@smta.org by Jan. 31. Include title, author’s name and contact information. Technical papers are optional, but PowerPoint presentations are required and due March 23.
 
SAN ANTONIO – SMT machine software sales hit $312.4 million in 2006 and will grow 35% to $558.3 million in 2013, according to research firm Frost & Sullivan.
 
The research firm says complete integration and ease of communication down the SMT line have driven software market growth. Customers are reportedly also more concerned with pricing and quality of the machine now, and not with the software that accompanies it.
 
“The SMT software market has been rejuvenated not only due to increase in equipment sales, but also due to increasing automation and technology of the software itself,” says Frost senior research analyst Lavanya Ram Mohan. “As the demands for increased integration, communication, quality and factory level optimization rise, these markets are likely to accrue significant revenues in future.”



 

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