News
CHIBA, JAPAN – The
top semiconductor equipment manufacturers last week predicted the market
would grow 3,7% in 2007, followed by 13% in 2008, ultimately hitting $50.42 billion by 2009, the SEMI
trade group said.
Survey respondents project 2006 sales will reach $40.64 billion, a 24% gain year-over-year.
The forecast is based on interviews conducted between late October and November with companies representing a majority of the total sales volume for the global semiconductor equipment industry.
DERBY, KS - Q Corp. has opened a new facility in Derby, KS. The company is celebrating its 35th anniversary this year. Q Corp. designs and manufactures tape-and-reel and lead trimming equipment. It has customers in more than 20 countries.
SUZHOU, CHINA – Phihong Technology has opened a $30 million, one million sq. ft. production plant in Suzhou. The facility, sited five miles from Phihong’s existing plant, will house up to 50 production lines, employ more than 9,000 workers, and will reportedly manufacture up to 50 million power supplies per month. The facility will manufacture power supplies, adapters and other electronics equipment.
SAN JOSE -- Bay Area executives are gaining optimism over their prospects, according to a quarterly survey.
Optimists outnumbered pessimists by more than four to one in the Silicon Valley, according to the quarterly Bay Area Business Confidence Index. The survey of 542 top executives was conducted in October by consulting firm McKinsey.
Optimists outnumbered pessimists by more than four to one in the Silicon Valley, according to the quarterly Bay Area Business Confidence Index. The survey of 542 top executives was conducted in October by consulting firm McKinsey.
DALLAS, OR -- Printed circuit board maker TTM Technologies will shutter its
Dallas, OR, facility, and lay off about 300 workers, the company said. TTM expects to take a charge of $2.6 million for
severance in the first quarter of 2007.
Production will be moved to other company sites, primarily in Logan, UT, and Redmond, WA.
Production will be moved to other company sites, primarily in Logan, UT, and Redmond, WA.
PENANG, MALAYSIA – Pac Tech will open a high-volume wafer bumping facility in Penang next year. The 40,000 sq. ft. location will be completed in June and will be designed for mass production of wafer bumping using electroless NiAu, solder stencil printing, wafer sawing, solder-ball placement and more. The facility will reportedly be able to process 600,000 wafers annually to start. The company will begin producing in volume in October.
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