News
Clinton, NY -- Indium Corp.’s vice president of technology, Dr. Ning-Cheng Lee, has been appointed to the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society Board of Governors.
Dr. Lee was named SMTA Member of Distinction in 2002, received the Soldertec Global Lead-Free Solder Award in 2003 and recently received the 2006 CPMT Exceptional Technical Achievement Award. He has also served as an SMTA board member, liaison to the Taiwan SMTA chapter, coordinator and chair of the 2005 Nepcon Shanghai technical program, and is author of two books and over 100 technical papers.
He has experience in the development of solders, fluxes, high-temperature polymers, encapsulates for microelectronics, underfills and adhesives. His current research interests cover advanced materials for interconnects, and packaging for electronics and optoelectronics applications, with emphasis on high performance and low-cost ownership.
RENTON, WA – Microscan is offering a free downloadable series of educational tutorials on Data Matrix symbol verification. Designed for any manufacturer who marks parts with Data Matrix, the series covers the major industry verification standards involved in determining symbol quality. They also provide information on quality parameters and how they affect the symbol grading process.
“Open source manufacturers are increasingly required to supply traceable parts and components using Data Matrix symbols,” said Matt Allen, product manager. “In any bar code application, reliable traceability begins with marking the highest quality symbol possible for that application. General education on the parameters that define a high quality symbol will solve most application challenges before they occur. The verification educational series will provide manufacturers with the knowledge and the tools they need to be successful from the start.”
Located at microscan.com/elearning, the tutorials are available in a series of downloadable multi-media presentations, or on CD-ROM by request.
ST. LOUIS -- LaBarge Inc. has been awarded a $10.7 million contract to continue to provide Northrop Grumman with electromechanical subsystems and modules for a state-of-the-art automated mail sorting system. The award continues LaBarge's production of the assemblies through May 2007.
LaBarge-built equipment is part of the Automated Flats Sorting Machine-Automated Induction (AFSM-ai) system, a fleet of machines that together can sort 26 billion pieces of flat mail per year. LaBarge began manufacturing the subsystems and modules in July 2005, under a previous contract. The equipment enhances the system's in-feed units, which the company manufactured between 1999 and 2002.
LaBarge-built equipment is part of the Automated Flats Sorting Machine-Automated Induction (AFSM-ai) system, a fleet of machines that together can sort 26 billion pieces of flat mail per year. LaBarge began manufacturing the subsystems and modules in July 2005, under a previous contract. The equipment enhances the system's in-feed units, which the company manufactured between 1999 and 2002.
LaBarge will perform the work at its Huntsville, AK, facility.
BUENOS AIRES -- Foxconn Electronics may site a manufacturing plant in Argentina in order to work more closely with its customers in Central and Lain America, according to a China language publication.
The Apple Daily further reported that Foxconn's wholly-owned handset subsidiary Foxconn International Holdings is considering a R&D center in Japan.
The Bromine Science and Environmental Forum today issued a statement that undercut an earlier missive from a European political group of the status of the chemical known as Deca-BDE.
According to the BSEF, a statement European Green made earlier this week regarding a nonbinding interpretation by the European Commission's DG Environment on Deca-BDE's exemption from the RoHS Directive "is incorrect and ignores the fact that the interpretation is under review. "
According to the BSEF, a statement European Green made earlier this week regarding a nonbinding interpretation by the European Commission's DG Environment on Deca-BDE's exemption from the RoHS Directive "is incorrect and ignores the fact that the interpretation is under review. "
El Segundo, CA — After a better-than-expected first quarter, iSuppli Corp. has upgraded its semiconductor forecast slightly for 2006, going to 7.9% from 7.4%. Worldwide semiconductor revenue will rise to $255.7 billion in 2006, up from $237 billion in 2005, iSuppli predicts.
“The rise in the 2006 semiconductor revenue outlook comes despite a slowdown in the markets for electronic equipment,” said Gary Grandbois, principal analyst. “Worldwide electronic equipment revenue growth will decline to 6.8% in 2006, from 8.2% in 2005.
“However, electronic equipment demand remains very strong, and continues to be driven by the healthy PC, mobile- phone and consumer-electronics markets. Furthermore, improving conditions in the semiconductor industry, bolstered by rising average selling prices and lengthening lead times, are propelling chip growth to a higher level than that experienced by the end-equipment markets.”
The company predicts that semiconductor market growth will peak in 2007 and then bottom out in 2009.
The major products behind the market’s growth in 2006 are analog and memory ICs. Analog ICs are experiencing a strong resurgence as prices are pushed up by suppliers to pass on increases in material costs. A healthy mobile-phone market, expected to post 14% unit growth this year, also is important to the growth of analog ICs.
Memory IC growth is led by the continuing strength of flash, an area that is expected to expand 27%. Flash memory growth, combined with an 8% rise in DRAM revenue, will generate total memory IC growth of nearly 15% for the year.
However, higher-than-expected growth seen in the first quarter will be followed by some sluggishness in the market in the second half. Second-half growth of 5% is less than normal seasonal expectations. Orders appear to be weakening and inventories are rising.
“The rise in the 2006 semiconductor revenue outlook comes despite a slowdown in the markets for electronic equipment,” said Gary Grandbois, principal analyst. “Worldwide electronic equipment revenue growth will decline to 6.8% in 2006, from 8.2% in 2005.
“However, electronic equipment demand remains very strong, and continues to be driven by the healthy PC, mobile- phone and consumer-electronics markets. Furthermore, improving conditions in the semiconductor industry, bolstered by rising average selling prices and lengthening lead times, are propelling chip growth to a higher level than that experienced by the end-equipment markets.”
The company predicts that semiconductor market growth will peak in 2007 and then bottom out in 2009.
The major products behind the market’s growth in 2006 are analog and memory ICs. Analog ICs are experiencing a strong resurgence as prices are pushed up by suppliers to pass on increases in material costs. A healthy mobile-phone market, expected to post 14% unit growth this year, also is important to the growth of analog ICs.
Memory IC growth is led by the continuing strength of flash, an area that is expected to expand 27%. Flash memory growth, combined with an 8% rise in DRAM revenue, will generate total memory IC growth of nearly 15% for the year.
However, higher-than-expected growth seen in the first quarter will be followed by some sluggishness in the market in the second half. Second-half growth of 5% is less than normal seasonal expectations. Orders appear to be weakening and inventories are rising.
Press Releases
- SIA Applauds CHIPS Act Incentives for Amkor Facility in Arizona
- ASMPT and IBM Deepen Collaboration to Advance Bonding Methods for Chiplet Packages for AI
- Murray Percival Company Expands Product Line with Representation of BIMOS ESD Seating in the Midwest
- Selectronic Assembly Welcomes Eliud Herrera as Production Manager