News
ATLANTA -- Circuits Assembly today launched its new Web log featuring up-to-the-minute reports and commentary on the electronics manufacturing industry.
The Web log (or "blog") is managed by Circuits Assembly editor in chief Mike Buetow, and will feature regular commentary from several leading technologists.
The blog is located at http://circuitsassembly.com/blog/.
The Web log (or "blog") is managed by Circuits Assembly editor in chief Mike Buetow, and will feature regular commentary from several leading technologists.
The blog is located at http://circuitsassembly.com/blog/.
NORWALK, CT – Revenue from major applications and products based on organic
electro-optical materials will spike from $2.6 billion last year to $10.5 billion by 2001, an average annual growth rate of 26.4%. According to a soon-to-be-released report from BCC Research, primary applications include displays, telecommunications and photonics, plus laser and nonlinear optics.
Sales of organic-based displays were $615 million last year, the firm says, about 24% of the total market. By 2011, the market will top $3 billion (29% share), BCC estimates, an AAGR of 30.8%.
Organic-based telecommunications and photonics materials were by far the largest market in 2005, accounting for about 75%, or $2 billion. By 2011, that segment will reach almost $7.5 billion, growing 24.9% annually.
Sales of organic-based displays were $615 million last year, the firm says, about 24% of the total market. By 2011, the market will top $3 billion (29% share), BCC estimates, an AAGR of 30.8%.
Organic-based telecommunications and photonics materials were by far the largest market in 2005, accounting for about 75%, or $2 billion. By 2011, that segment will reach almost $7.5 billion, growing 24.9% annually.
KUALA LUMPUR -- Overlooked by the media, but not by investors, Malaysia continues to be a quiet hot spot for foreign investment in electronics manufacturing.
Outside investors poured $4.9 billion into manufacturing facilites in Malaysia last year, the highest mark since 2001, according to the nation's trade ministry. Electrical and electronics products accounts for half the Southeast Asia nation's annual exports.
Outside investors poured $4.9 billion into manufacturing facilites in Malaysia last year, the highest mark since 2001, according to the nation's trade ministry. Electrical and electronics products accounts for half the Southeast Asia nation's annual exports.
MINNEAPOLIS -- CyberOptics reported fourth-quarter sales of $12.1 million, up 17% sequentially and 7.9% year-over-year. For the period ended Dec. 31, net income was $5.2 million, including non-cash income of $3.7 million, up from $626,000 or in the third quarter and $794,000 last year.
Revenue and earnings exceeded company guidance.
Revenue and earnings exceeded company guidance.
Clinton, NY – Assembly materials supplier Indium Corp. offers an Electronics Assembly Reliability Program to meet the performance challenges facing electronics assemblers. The program combines products, service and technologies to optimize finished goods reliability.
Products featured in the reliability program include:
Indium5.1 Pb-Free, No-Clean Solder Paste -Addresses via-in-pad voiding, CSP printing for SMT Reliability.
Wave Solder Products (WF7742, PIP+ Preforms) -Addresses incomplete barrel fill with Pb-Free alloys for PTH Reliability.
No-Flow Underfills (NF220, NF260) -Addresses joint cracking due to brittle Pb-Free alloys and reduced-size joints for CSP Reliability.
Thermal Interface Materials (solder TIM) -Addresses thermal performance issues caused by increased power and reduced component size for Thermal Reliability.
The program also offers customers new process and application concepts as well as the industry’s largest SMTA-certified engineering staff, an online interactive technology knowledgebase and online Pb-free readiness assessment software.
For more info, visit indium.com/reliability .
Products featured in the reliability program include:
Indium5.1 Pb-Free, No-Clean Solder Paste -Addresses via-in-pad voiding, CSP printing for SMT Reliability.
Wave Solder Products (WF7742, PIP+ Preforms) -Addresses incomplete barrel fill with Pb-Free alloys for PTH Reliability.
No-Flow Underfills (NF220, NF260) -Addresses joint cracking due to brittle Pb-Free alloys and reduced-size joints for CSP Reliability.
Thermal Interface Materials (solder TIM) -Addresses thermal performance issues caused by increased power and reduced component size for Thermal Reliability.
The program also offers customers new process and application concepts as well as the industry’s largest SMTA-certified engineering staff, an online interactive technology knowledgebase and online Pb-free readiness assessment software.
For more info, visit indium.com/reliability .
Edina, MN --The SMTA is seeking papers for its third annual International Wafer-Level Packaging Conference and Exhibition. The event will take place on Nov. 2-3 in San Jose, CA, and will track IC packaging and test technologies with emphasis on 3-D stacked packaging.
Submit 200-word abstracts by e-mail to Melissa Serres (melissa@smta.org) by April 1.
Dr. Ken Gilleo, ET-Trends LLC, Circuits Assembly columnist and SMTA VP of Technical Programs, and Terry Thompson of Chip Scale Review will co-chair the technical program.
Submit 200-word abstracts by e-mail to Melissa Serres (melissa@smta.org) by April 1.
Dr. Ken Gilleo, ET-Trends LLC, Circuits Assembly columnist and SMTA VP of Technical Programs, and Terry Thompson of Chip Scale Review will co-chair the technical program.
Press Releases
- ASMPT and IBM Deepen Collaboration to Advance Bonding Methods for Chiplet Packages for AI
- Murray Percival Company Expands Product Line with Representation of BIMOS ESD Seating in the Midwest
- Selectronic Assembly Welcomes Eliud Herrera as Production Manager
- SP Manufacturing Holds Milestone Anniversary Celebration