News
San Francisco, CA - Design Chain Associates and EPTAC Corp. will continue its one-day seminar series, "Thriving in a RoHS/WEEE Environment," throughout the U.S. in 2006.
The seminar will cover the EU directives and add all new information on this continuously evolving issue, including insights into new alloys, explanations of China RoHS, supplier updates, reliability updates and more.
This seminar is designed for OEMs, distributors, contract manufacturers and outsource design and manufacturing firms. It is geared toward executive management that needs to determine strategic direction as well as anyone involved in the implementation and execution of the required changes to conform and thrive. Teams are urged to attend since environmental compliance impacts many groups.
The course will provide information in seven fundamental areas impacted by the environmental laws, including EU's Thematic Strategies to Japan's new legislation; business environment; resources; business processes; DfE; manufacturing processes; and equipment.
Future dates include:
San Diego February 14
San Jose February 16
Boston March 7
Atlanta March 9
Austin April 11
Dallas April 13
Minneapolis May 4
Chicago June 8
The seminar will cover the EU directives and add all new information on this continuously evolving issue, including insights into new alloys, explanations of China RoHS, supplier updates, reliability updates and more.
This seminar is designed for OEMs, distributors, contract manufacturers and outsource design and manufacturing firms. It is geared toward executive management that needs to determine strategic direction as well as anyone involved in the implementation and execution of the required changes to conform and thrive. Teams are urged to attend since environmental compliance impacts many groups.
The course will provide information in seven fundamental areas impacted by the environmental laws, including EU's Thematic Strategies to Japan's new legislation; business environment; resources; business processes; DfE; manufacturing processes; and equipment.
Future dates include:
San Diego February 14
San Jose February 16
Boston March 7
Atlanta March 9
Austin April 11
Dallas April 13
Minneapolis May 4
Chicago June 8
Bolton, MA -- DownStream Technologies opened its new corporate headquarters in Marlborough, MA. Located in region’s high-tech corridor along Rte. 495, the facility will house the company’s financial, marketing, sales and R&D operations.
“With the introduction of our newest product, BluePrint for PCBs and the increase in sales of our industry-standard CAM350, it became apparent that we needed to expand in order to accommodate the growth of the company,” said Rick Almeida, founder of DownStream. “Our new facility is optimally equipped to help us respond to the needs of our customers, as well being ideally located so we can continue to attract the best talent in the high-tech industry.”
The new facility allows the company to add engineering and support personnel.
The new address is:
DownStream Technologies, LLC
225 Cedar Hill Street, Suite 33
Marlborough, MA 01752
(508) 970-0670
“With the introduction of our newest product, BluePrint for PCBs and the increase in sales of our industry-standard CAM350, it became apparent that we needed to expand in order to accommodate the growth of the company,” said Rick Almeida, founder of DownStream. “Our new facility is optimally equipped to help us respond to the needs of our customers, as well being ideally located so we can continue to attract the best talent in the high-tech industry.”
The new facility allows the company to add engineering and support personnel.
The new address is:
DownStream Technologies, LLC
225 Cedar Hill Street, Suite 33
Marlborough, MA 01752
(508) 970-0670
PALO ALTO -- SiliconPipe received the Frost & Sullivan 2005 Excellence in Technology Award in the field of system-level interconnect solutions for its Novias technology. The technology is based on the removal of performance-limiting and expensive plated vias from the interconnection channel.
The technology was developed to create stair step interconnections among IC packages, interconnection substrates and connectors. Prototypes have already been introduced and it will soon be incorporated in products.
"SiliconPipe interconnection technologies enable product and system designers to use simple I/O buffers to send signals well beyond 2 Gbps," says F & S research analyst Sivakumar Muthuramalingam. "The company's innovations in interconnect technologies cover the entire spectrum of electronic assembly from their simple, cost-effective Stair Step Packaging (SSP) for ICs to low cost, high performance, backplane connectors used in PCBs."
"SiliconPipe's unique and novel solutions leverage existing manufacturing infrastructure and cost reductions and performance gains are achievable with relatively simple modifications to current design and manufacturing practices," notes Muthuramalingam. "Since these interconnection channels will operate at frequencies that are well beyond today's requirements, current products that incorporate these 'clean' interconnections could offer advantages of lower power consumption and better scalability."
The technology was developed to create stair step interconnections among IC packages, interconnection substrates and connectors. Prototypes have already been introduced and it will soon be incorporated in products.
"SiliconPipe interconnection technologies enable product and system designers to use simple I/O buffers to send signals well beyond 2 Gbps," says F & S research analyst Sivakumar Muthuramalingam. "The company's innovations in interconnect technologies cover the entire spectrum of electronic assembly from their simple, cost-effective Stair Step Packaging (SSP) for ICs to low cost, high performance, backplane connectors used in PCBs."
"SiliconPipe's unique and novel solutions leverage existing manufacturing infrastructure and cost reductions and performance gains are achievable with relatively simple modifications to current design and manufacturing practices," notes Muthuramalingam. "Since these interconnection channels will operate at frequencies that are well beyond today's requirements, current products that incorporate these 'clean' interconnections could offer advantages of lower power consumption and better scalability."
The award is presented yearly to the company that has pioneered the development and introduction of an innovative technology into the market; a technology that has either impacted or has the potential to impact several market sectors.
AUSTIN, TX – 3M Electronics’ advanced laminate, 3M Embedded Capacitor Material, is RoHS compliant.
It can be made with a dielectric thickness down to 8 microns and a capacitance density over 10 nanofarads/sq.in., which makes it among the thinnest and highest capacitance density materials available for embedding planar capacitance in circuit boards. When used as “power” and “ground” layers in a multilayer PCB, it becomes a shared decoupling capacitor inside the board, allowing for the elimination of many discrete surface-mount capacitors and their associated vias.
The material is compatible with rigid and flex PCB processing, including laser drilling.
It can be made with a dielectric thickness down to 8 microns and a capacitance density over 10 nanofarads/sq.in., which makes it among the thinnest and highest capacitance density materials available for embedding planar capacitance in circuit boards. When used as “power” and “ground” layers in a multilayer PCB, it becomes a shared decoupling capacitor inside the board, allowing for the elimination of many discrete surface-mount capacitors and their associated vias.
The material is compatible with rigid and flex PCB processing, including laser drilling.
Shropshire, UK – UK Manufacturers may get another six-month reprieve to implement the EU’s WEEE legislation, if a report from B2B Compliance proves true.
According to the report, the government is considering a proposal to delay the legislation until June 2006, with producer responsibility commencing in January 2007.
As yet, however, no further delays have been posted on the Department of Trade and Industry’s Website. Last August, the DTI announced that responsibility would not commence until June 2006, pushing back the deadline (originally, Aug. 15, 2005, then delayed to January 2006) due to insufficient preparations.
According to the report, the government is considering a proposal to delay the legislation until June 2006, with producer responsibility commencing in January 2007.
As yet, however, no further delays have been posted on the Department of Trade and Industry’s Website. Last August, the DTI announced that responsibility would not commence until June 2006, pushing back the deadline (originally, Aug. 15, 2005, then delayed to January 2006) due to insufficient preparations.
Munich – Markets for microsystems will double over the next five years from $12 billion in 2004 to $25 billion in 2009, a CAGR of 16%, according to a market report by NEXUS.
MST/MEMS sensors and actuators are predicted to continue to consolidate their position in established IT peripheral markets for read/write heads and inkjet heads, in addition to creating new opportunities for microphones, memories, micro energy sources and chip coolers.
The automotive sector remains a major application field with several high-volume safety products including air bags and tire pressure monitoring systems.
Helping propel the market is the meteoric rise of the consumer electronics segment, forecast to almost quadruple its share from 6% of the market in 2004 to 22% in 2009 (a CAGR of 50%).
“The growth of consumer electronics for MST is breathtaking,” said Dr Henning Wicht, managing director of WTC. “In this segment we see rear and front projection TVs for home theater, as well as HDDs serving the increasing storage requirements of digital equipment such as DVD recorders, digital cameras and camcorders, and portable MP3 players. A big driver is the mobile phone, which already features motion sensors and is amenable to a battery of additional sensors and functions like liquid lenses for camera zoom, fingerprint sensors, microfuel cell power sources, gas sensors and weather barometers.”
Of the 26 products analyzed in the report, 14 will have market volumes over $100 million, and completely new products such as microfuel cells, fingerprint sensors and liquid lenses will worth a combined $250 million in five years.
The study, NEXUS Market Analysis III, was coordinated by WTC (Wicht Technologie Consulting) on behalf of NEXUS (The Network of Excellence in Multifunctional Microsystems).
MST/MEMS sensors and actuators are predicted to continue to consolidate their position in established IT peripheral markets for read/write heads and inkjet heads, in addition to creating new opportunities for microphones, memories, micro energy sources and chip coolers.
The automotive sector remains a major application field with several high-volume safety products including air bags and tire pressure monitoring systems.
Helping propel the market is the meteoric rise of the consumer electronics segment, forecast to almost quadruple its share from 6% of the market in 2004 to 22% in 2009 (a CAGR of 50%).
“The growth of consumer electronics for MST is breathtaking,” said Dr Henning Wicht, managing director of WTC. “In this segment we see rear and front projection TVs for home theater, as well as HDDs serving the increasing storage requirements of digital equipment such as DVD recorders, digital cameras and camcorders, and portable MP3 players. A big driver is the mobile phone, which already features motion sensors and is amenable to a battery of additional sensors and functions like liquid lenses for camera zoom, fingerprint sensors, microfuel cell power sources, gas sensors and weather barometers.”
Of the 26 products analyzed in the report, 14 will have market volumes over $100 million, and completely new products such as microfuel cells, fingerprint sensors and liquid lenses will worth a combined $250 million in five years.
The study, NEXUS Market Analysis III, was coordinated by WTC (Wicht Technologie Consulting) on behalf of NEXUS (The Network of Excellence in Multifunctional Microsystems).
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