NEW YORK -- Semiconductor customers will continue to increase consumption of
multichip devices and PLDs over the next 12 months, suggests a recent survey of purchasing managers.
Investment bank SG Cowen said today that its poll of 250 procurement specialists provides "multi-year empirical data ... and serves
as an important, independent validation."
The firm said 65% of participants expect year-over-year gains in
purchases of chipset solutions and reference designs in the next 12
months. This is an increase from each of SG Cowen's three prior
surveys, conducted in last February, October 2004 and July 2003.
Thirty-two percent of participants expect to increase purchases of PLDs within the next 12 months. This is
unchanged from February but up 10 points from the July 2003 survey.
BERG, SWITZERLAND -- Alphasem Co. Ltd. has relocated its die-attach operations in China from Shenzhen to a larger premises in Suzhou.
The company,
also makes die sort systems for semiconductor production, generates
about 75% of its sales in Asia.
The company founded the subsidiary three years ago, in Shenzhen.
The Suzhou plant will employ 30 workers, a number which the company said will increase significantly in the future.
NEW YORK -- Banc of America
Securities says EMS demand should pick up in the second half as customers exhaust their budgets ahead of the next fiscal year.
"We still expect a second-half seasonal pick-up in demand due to
corporate 'budget flush' and consumer holiday spending," said Banc of
America. "On a year-over-year basis, we see mid-to-high single-digit
growth in IT spending."
The analyst rated Flextronics and Benchmark as its best buys, while noting problems at Solectron and Sanmina-SCI.
HONG KONG -- Foxconn International
reported first-half net earnings of $146.9 million, up 66% from
$88.3 million last year. For the six months ended June 30, the ODM
posted revenue of $2.35
billion, up from $1.29 billion a year ago.
Torrance, CA – Excellon Automation has opened its new
corporate offices and North American production facility in Rancho
Dominguez, CA. The relocation efforts will be completed by mid-October.
“Our current facility is outdated and no longer
supports our North American production needs or provides the necessary
capabilities for our world headquarters operations, “ said David
Balsbough, president. “With our increased emphasis on customer support
and technology leadership we need a facility that supports these
objectives while providing efficient and flexible operating
capabilities.”