News
HANOI -- Is Intel headed for India?
The world's leading chipmaker is reportedly considering locating a major chip packaging factory in India or Vietnam.
Intel chief executive Paul Otellini reportedly said Vietnam and other countries were possible locations for the facility. The estimated price tag for the plant: $400 million.
SAN JOSE -- The industry trade group SEMI will discuss the world's semiconductor equipment market in a special Webcast next week.
The Webcast will cover the global semiconductor equipment and materials markets. It will also include highlights from a recently completed report on the market for semi gear and materials in China.
SINGAPORE -- Flextronics has signed separate agreements for the sale of its network services and semiconductor business units. Both deals were previously announced.
The transactions will generate aggregate upfront cash of more than $550 million plus additional deferred and contingent payments and a 30% ownership stake in the merged network services company. Both transactions are expected to close before the end of the September quarter.
TAIPEI -- Hon Hai Precision, which operates Foxconn, the second-largest electronics manufacturing services company, is pursuing an aggressive acquistion strategy, the company said this week.
The Taipei Times quoted Hon Hai chairman Terry Gou as saying, "We have been working on [more mergers]. We hope to settle one, or two deals in the second half of the year." Gou's comments were reportedly made after the company's annual shareholders' meeting.
MINNEAPOLIS, MN – The Surface Mount Technology Association (SMTA) has announced the technical sessions for its annual conference, SMTA International, co-located with the Assembly Tech Expo show in Rosemont, IL, Sept.25-29.
The 1.5-hour technical sessions each present three technical papers under the direction of a chairman. They are arranged according to tracks on Manufacturing and Assembly, Advanced Packaging, Substrates, RoHS and Process Control, covering topics such as lead-free soldering and rework, HDI, RFID, microdevices, BGA reliability, CSP and flip-chip technologies, selective soldering, lead-free process control, leadless packaging, surface finishes, RoHS compliance, harsh environments and AOI.
The RFID mini-conference has three paper sessions on Production Lines, Tag Materials and Processing, and Applications in the Electronics Manufacturing Industry. Two new sessions will cover RoHS compliance. Technical papers on lead-free will address reflow and wave soldering, rework, key issues in lead-free/RoHS manufacturing, lead-free CSP reliability, HASL surface finishes, effects on PCBs, surface finishes, process control, and
RoHS test methods and compliance, customer and industry requirements, and due diligence approach to WEEE/RoHS compliance.
Organized by Dr. Paul T. Vianco of Sandia National Labs, the Lead-Free Soldering Symposium will consist of technical sessions organized by the Joint Council on Aging Aircraft / Joint Group on Pollution Prevention Lead-free Solder Consortia Project, as well as sessions on Process for Lead-free Implementation and Lead-free Reliability.
The Contract Manufacturing Symposium, organized by Mike Buetow, UP Media Group/Circuits Assembly, will feature paper sessions on Mid-Tier
EMS Strategy and Models and Markets.
Led by Dr. Reza Ghaffarian, Jet Propulsion Labs, the Emerging Technologies Summit will feature papers on Roadmaps, Turning Lead Into Gold and Advanced Power Technology.
For more info: smta.org/smtai
Canada BRIO is positioned to provide customer management, BOM sourcing and technical communications, the company said.
“China today has evolved to become a global manufacturing base”, says Yang Tongxing, president and cofounder. “North America’s small- to mid-tier CMs/OEMs/ODMs have not been able to access Chinese EMS production opportunities enjoyed by larger competitors."
Founded in 1999, BRIO is one of
The company operates manufacturing facilities in Beijing and Shanghai, with a total of 16 SMT lines (Panasonic, Samsung and Juki).
The company performs NPI to volume production.
