News
TORONTO - Celestica Inc. has named Craig Muhlhauser president and executive vice president of worldwide sales and business development. Muhlhauser was previously president and chief executive of Exide Technologies. He will lead the EMS maker's global sales and business development effort and drive the growth strategy.
Muhlhauser has over 25 years of sales, marketing and general management experience with GE, United Technologies and Ford. Muhlhauser holds a masters in mechanical engineering and a bachelor's in aerospace engineering from the University of Cincinnati.
"I am very excited to have Craig Muhlhauser join the Celestica team. I had the pleasure of working with Craig at Ford and know him to be an extremely capable, customer-focused senior executive," said Steve Delaney, CEO of Celestica. "Craig's vast sales and marketing expertise, and his creativity in developing integrated offerings, will be a great asset to Celestica and, ultimately, our customers."
In addition to this change, Marvin MaGee, Celestica's former head of worldwide business development has been named executive vice president, worldwide operations. MaGee will be responsible for managing Celestica's global manufacturing network, as well as implementing site-to-site consistency in Lean, Six Sigma, organization capability and customer care.
MaGee joined Celestica's executive team in 1997. Prior to that, he spent 18 years with IBM Canada where he held multiple senior management positions in manufacturing and development. MaGee holds a bachelor's in mechanical engineering from the University of New Brunswick and an MBA from McMaster University.
For the period ended March 31 the net loss was $1.1 million, down from a profit of $129 million last year.
Sequentially quarterly revenues rose 16.5%, and the quarterly net loss fell 29%.
Jaco chairman and chief executive Joel Girsky said, "We are continuing to evolve our
business model to strengthen our market presence while simultaneously reducing
all nonessential costs. Our strategy is based on an ongoing focus on our flat panel display capability, marketing efforts targeted at business in the
U.S. and the reduction of overhead and costs without impairing our ability to support
our customers.
During the quarter, the company reduced SG&A costs 10.3%
year-on-year and 8%
sequentially.
"Jaco remains focused on capturing U.S. business, and we recently
expanded our quote group team" to focus on mid-level contract manufacturers," Girsky said.
The course teaches key concepts through presentation, practice and testing of the material. Learning takes place at any time or place that is conducive for the student, with a final interactive test for certification of the concepts learned in the program. The course can be conducted over a company LAN or through the internet. Translated versions will be offered in German and Chinese.
Minneapolis, MN -- Dr. Bruce McWilliams, chairman and CEO of Tessera Technologies, will present the keynote speech at the International Wafer-Level Packaging Conference, Nov. 3-4, at the San Jose DoubleTree Hotel, CA. The keynote, "Why Wafer-Level? Its Promise and its Future", will be given at a special dinner on November 3.
He will explore the universe of semiconductors and semiconductor packaging technologies and look at the promise offered by wafer-level packaging, including "killer" applications that will propel growth and the technical hurdles that must be overcome.
Dr. McWilliams joined Tessera in 1999 as president and CEO. He became chairman in February 2002. He had previously served as president and CEO of S-Vision Inc., a silicon-chip-based display company that he co-founded. He was also a senior vice president at Flextronics International Ltd.
The event features an exhibition of suppliers to the semiconductor packaging and testing industry, and the technical program explores semiconductor packaging, including chip scale packaging, 3-D packaging, system-in-package, system-on-chip, system-on-package and wafer-level packaging.
For more info: smta.org/iwlpc/
SAN JOSE - Worldwide semiconductor manufacturing equipment billings reached $9.4 billion in the first quarter, according to the industry trade group SEMI, up 2.3% from a year ago and 6.5% sequentially. Bookings ($7.25 billion) were down 21% from a year ago and 12% from the fourth quarter.
The data, collected in concert with the Semiconductor Equipment Association of Japan, come from more than 150 equipment companies.
"The
first quarter billings showed some positive momentum over the fourth
quarter of last year, while worldwide bookings for semiconductor
manufacturing equipment are down for the same period," said Stanley T.
Myers, president and CEO of SEMI.
Billings in Korea were up
significantly sequentially, Myers said.
HERNDON, VA - The International Electronics Manufacturing Initiative (iNEMI) is sponsoring a workshop on tin whiskers as part of IEEE's Electronic Components and Technology Conference on May 31-June 3, in Lake Buena Vista, FL. iNEMI will present the results of its third set of whisker experiments, , which provide additional insight into tin whisker formation and growth.
Presentations will also cover the latest theories regarding the cause and effect of stress formation in tin film, the mechanism by which material moves through the structure, and the causes of whisker growth. In addition, a recently discovered factor in tin whisker generation will be discussed - heavy oxidation or "corrosion" of the tin in humid environments. Data on testing and the impact of oxidation on whisker growth will be covered.
Dr. Henning Leidecker, NASA, will serve as moderator for the workshop. The event is chaired by Ron Gedney, iNEMI consultant, and Maureen Williams, NIST. For a complete agenda:
http://www.inemi.org/cms/calendar/tin_whisker_workshop.html.
In addition to the iNEMI workshop, the ECTC technical program includes a session on solder and tin whiskers (Session #10, Materials & Processing Committee) on June 1.
Online registration is available at
https://www.ec-central.org/conference/ectc/55/doorregistrationform.cfm.
