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PALO ALTO, CA -- Agilent Technologies Inc. has introduced the Versatest Series Model V5500, a final test solution for multichip package devices (MCP) and discrete flash memory. The tester-per-site architecture and optional Programmable Interface Matrix are said to optimize single-insertion testing of MCPs with multiple memory types (Flash, DRAM and SRAM).

Has 16,384 pins per testhead, to fully utilize x320 handlers at up to 320 NAND devices in parallel. Enables parallel testing of high-pin-count NOR and MCPs at up to 256 devices in parallel.

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BOSTON -- Teradyne Inc. is laying off 400 employees, or approx. 7% of its workforce, with the cuts falling on the semiconductor test unit. The division produced nearly half of Teradyne’s net bookings in the first quarter, according to a release published by the Boston Business Journal.

The company did not immediately specify what locations would be affected. In June it sold its PCB manufacturing unit in North Reading, MA, to a division of Solectron.

Teradyne expects to complete the current layoffs by the end of the year, and said it would record severance charges of approximately $12.7 million and $4 million, respectively, for the third and fourth quarters.

BUFFALO, NYNanoDynamics has opened an online Sample Store (nanodynamics.com/Home/samplestore) to minimize the hassle of evaluating or qualifying its products. Customers can order metal powder samples over the Internet and have them delivered anywhere.

The store will initially offer nanosilver and copper powder lines, with future plans to include nanosized nickel powders, nanoceramic powders and dispersions, carbon nanotubes and nanoclays.

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Thief River Falls, MN -- Digi-Key and Freescale are hosting an exclusive design contest using the new MC9S12NE64xx Microcontroller. The grand prize is an Arctic Cat H1 ATV and trailer, and various cash prizes will be awarded. U.S. and Canadian residents can submit designs until August 15.


The contest offer is void where prohibited by law.

 

For more information on contest rules, prizes and registration:

US:   http://dkc1.digikey.com/us/mkt/Contest/DKFS_2.html

Canada:  http://dkc1.digikey.com/ca/mkt/Contest/DKFS_2.html

PHOENIX – EMS provider Suntron Corp. announced that its Northwest Operations (NWO) facility in Newberg, OR, received ISO 13485 certification for medical product manufacturing. The facility's quality system is also certified to ISO 9001:2000 and AS9100.

“We are pleased to have received our ISO 13485 certification which demonstrates Suntron's focus on providing the highest quality services while maintaining strict medical manufacturing standards," said Paul Singh, president and CEO. "This key medical certification is a milestone in our continuous quality improvement initiatives that provides Suntron with a competitive advantage in highly regulated industries.This accomplishment is an important strategic step and vital to supporting our customers success in the medical device market.”

MINNEAPOLIS, MN --  The SMTA has finalized the conference program for SMTAI, held Sept. 25 - 29, in Rosemont, IL.

Technical sessions held on Tuesday and Wednesday are organized into tracks on Manufacturing and Assembly, Advanced Packaging, Substrates, RoHS and Process Control.

Full- and half-day educational courses, offered on Sunday and Monday, will focus on Manufacturing and Assembly, Advanced Packaging, Substrates, Soldering, Test/Inspection/Quality and Process Control. Of the 30 tutorials offered, 16 are entirely new and 13 will focus on lead-free and environment-friendly issues.

The Emerging Technologies Summit on Monday will feature sessions on Roadmaps, Turning Lead into Gold, Advanced Power Technology and will conclude with an Emerging Technologies panel.

The Contract Manufacturing Symposium on Tuesday will consist of paper sessions on Mid-Tier EMS Strategy and Models and Markets. The Lead-Free Symposium on Thursday will feature paper sessions on the Joint Council on Aging Aircraft (JCAA) / Joint Group on Pollution

Prevention (JCPP) Lead-free Solder Project and additional sessions on Process Implementation and Reliability.

Two workshops will be held on Thursday morning on Lead-free Reflow Soldering Using Convection Dominant Ovens and Emerging Technologies Today & Tomorrow - The Next 50 Years.

Free events include:

- The Opening Session on RoHS Compliance and Lead-free

- A presentation on iNEMI Roadmaps

- A panel discussion on environmental efforts beyond lead-free implementation

- A technical session on Process Improvement and Lean Manufacturing in PCB Assembly

- A presentation on Rapid Setup and Turnover

- A mini-conference on radio frequency identification (RFID) technology

- A panel discussion on the RoHS and WEEE directives

- A technical session on Lead-free Reflow

The Board Authority Live: Impact of Green Technologies will address the impact of environmental legislation on PCB design, fabrication and assembly.  It will cover issues like lead-free and halogen-free laminate selection, tin whisker reduction, lead-free reliability data and using HDI to reduce manufacturing costs associated with RoHS and WEEE Directive compliance.

Board Talk will once again uncover the truths and myths of electronics assembly, with all proceeds being donated to the Charles Hutchins Educational Grant ($25 SMTA members/$30 non-members).

The keynote during the Annual Meeting and Luncheon on Wednesday will feature Dan Shea, CTO of Celestica, dicussing " The Impact of  Temperature on Hybrid and Compliant Assemblies." 

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