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SCOTTSDALE, AZ, Oct. 15 -- A pair of economists who track the electronics industry this week offered differing opinions on what's in store for the recovering sector.

The outlook for capital spending is "generally favorable" due to higher demand for replacement equipment and a need for greater efficiencies, said Dr. Larry Chimerine. Companies are sitting on extraordinary cash reserves and financing is available from outside sources, said Chimerine, who spent 14 years as manager of U.S. economic research and forecasting at IBM.

Speaking Tuesday at the TMRC meeting in Scottsdale, Chimerine said that although the environment remains nearly impenetrable to product price hikes, companies will need to invest in new equipment in order to compete. "If you can't raise prices, you must improve productivity 3 to 4% every year just to stay even" with higher energy costs, vendor price hikes and raises to employee wages, Chimerine said.

A somewhat different outlook was given by Ed Henderson of Henderson Ventures. Henderson, a longtime PCB industry analyst, forecast a slowdown in annual global GDP through 2006, and a corresponding drop in equipment sales.

Annual GDP growth worldwide will slow from 4% this yer to 3.5% in 2005 and 3.1% in 2006, Henderson predicted. Likewise, global sales of electronics equipment will drop from 13.4% this year to 9.1% in 2005 and 5.7% in 2006. The figures are based on actual exchange rates.

The bare PCB market, now in its second year of recovery, will also fall, Henderson said. After 7.4% and 13.8% growth in 2003 and 2004, respectively, global PCB sales will slip to 6.4% next year as prelude to a 2006 recession, when sales will be 0.8% lower than in 2005, he said.

While pointing out that oil use as a percent of U.S. GDP has declined steadily over the past 20 years, Henderson said peaking oil prices could precipitate a sharp downturn. "Although a global receission is not in the forecast, a sustained oil price in the $60 to $70 range could produce an economic downturn in 2005."

Trade Barriers

Chimerine singled out trade deficits as a major longterm hurdle for the U.S. economy. Noting trade barriers enacted by several Pacific Rim nations, most notably China, that effectively squeeze American-made products from Asian markets, Chimerine asserted that trade has become an economic growth issue.

"The outsourcing of production [is] the real drag" on the economy, he said. "The manufacturing base must be strong. Not all chips [ICs, potato] are the same."

U.S. trade deficits with China and overall have this year ballooned to all-time highs, with some forecasts predicting a $550 billion gap by year-end.

Pointing to the Bush Administration's current policy of not waging battles over suspected currency manipulation by China, Japan and Taiwan, Chimerine said, "We are insane in keeping this in place," he said.

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ROCHESTER, NY, Oct. 15 - EMA Design Automation has entered an agreement to exclusively distribute and support Chronology's TimingDesigner timing analysis tool in North America.

"Timing analysis plays an increasingly prominent role in the identification and resolution of system operation issues," said Manny Marcano, president and CEO of EMA, in a statement. "Through this collaboration, we can now offer our customers the ability to obtain fast and complete timing margin analysis for their designs."

Chronology is a division of Forte Design Systems.

TimingDesigner is an interactive timing analysis and diagram tool for defining timing constraints, evaluating timing parameters, creating specifications and analyzing complex interfaces.

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SCHÄRDING and RADFELD, Austria -- EV Group, a supplier of wafer-bonding and lithography equipment, and Datacon Technology AG, a flip-chip and die bonding equipment supplier, announced a development, sales and marketing agreement for advanced-chip-to-wafer (AC2W) technology.

AC2W technology offers high device density through stacked devices, short interconnects and higher functional density. It enables the integration of various device technologies such as hybrid integration of IC and MEMS functionality.

The EVG540C2W chip-to-wafer bonder permanently bonds a wafer with single devices under defined process conditions, after they have been fixed with a temporary fixing agent in a high-precision flip-chip bonder from Datacon. The technology used for the bonding process is called face-to-face solid liquid interdiffusion, a technology that uses a metal soldering process.

"Our equipment allows a pre-bonding performance of up to 8500 chips per hour together with placement accuracy of 10µm@3s", said Helmut Rutterschmidt, president of Datacon Technology AG. "[We] can handle top chips as thin as 50 µm and wafers up to 300 mm diameter."

Developed in a joint R&D project, the new equipment platform has been successfully installed at Infineon AG, a major semiconductor device manufacturer.

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HSIN CHU, TAIWAN, Oct. 15 -- Kulicke & Soffa Industries today opened a state-of-the-art probe card manufacturing facility here, a move designed to boost the company's presence in the vertical probe card market.  

The plant has 2,400 sq. meters of floor space and will build enhanced cantilever probe cards. It can also handle probe wire diameters from 75 to 250 microns and very fine pitch probing.

The factory will follow K&S' "copy exact" manufacturing model.

Production on after-sales support center for repair and rebuild services in its final stages, the company said.

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SINGAPORE, Oct. 14 -- Flextronics said today its takeover of a pair of Nortel Networks' manufacturing plants would be delayed.

The two Canadian facilities are expected to be transfered in February and May 2005, respectively. Previously, Flextronics was to take charge of the plants in November 2004 and February 2005.

The deal is expected to add $2.5 billion of revenues for Flextronics.

In a statement Flextronics' officials said the deal would go through as otherwise planned.

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Research Triangle Park, NC, Oct. 13 -- MCNC Research & Development Institute (MCNC-RDI), a North Carolina-based nonprofit research organization, and the North Carolina Agricultural and Technical State University (N.C. A&T) will partner to conduct research related to technological advancements in flexible displays for U.S. Army mobile electronics applications. 

 

The $1.5 million award, spanning three years, establishes the Center of Excellence for Battlefield Capability Enhancements to develop technologies for environmentally stable flexible displays. 

 

N.C. A&T and MCNC-RDI propose to develop a hybrid light-emitting device (HLED) for mobile electronics and vehicle-based communications and weapons systems required by Future Force Warrior (FFW), the U.S. Army's initiative to develop and demonstrate revolutionary support systems for soldiers.

 

To develop the HLED technology, MCNC-RDI will combine its OLED experience with N.C. A&T's expertise with narrow bandgap semiconductors composed of inorganic materials. MCNC-RDI and N.C. A&T research facilities will be used throughout the project. Read more ...

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