News
TAIPEI, Oct. 11 -- Chip-on-board packages could get caught in an upward draft as image sensor modules in camera phones are switched from CSPs.
As much as 50% of camera phone models will be 1.3-megapixel type in 2005, DigiTimes reported today, citing market sources. The models will use COB packaging for CMOS-sensor modules, the Asian-based news service said.
Micron Technology and IC Media began offering COB CMOS sensors earlier this yer, DigiTimes said.
Des Plaines, IL, Oct. 11 — The next Lead-Free Technology Seminar presented by Kester, Metcal, BTU International and Soldering Technology Inc. (STI) will take place Nov. 9-10, 2004, in Atlanta, GA .
Designed to assist electronics assembly manufacturers with the implementation of lead-free assembly operations, the seminar covers Pb-free soldering in SMT, wave soldering, BGA profiling and rework. Successful case studies will also be discussed.
The seminar will help attendees develop a solid understanding of the process variables to maintain production yields and product reliability with Pb-free operations. Additional topics will include alloy selection, flux selection, wave process, SMT assembly, inspection and documentation, rework and hand soldering, reflow optimization and lead-free reliability.
Presenters include:
· Peter Biocca, senior market development engineer, Kester
· Paul Wood, market development manager, Metcal
·Fred Dimock, senior process engineer, BTU International
· Jason Gjesvold, analytical lab manager, STI.
To register, visit www.metcal.com.
For additional details, contact Theresa Rudnick, Kester, at (847) 699-5580 or trudnick@kester.com.
According to the SEMI Silicon Manufacturers Group, wafer shipments will end 2004 up 23% year-on-year. But the group predicts wafer shipments will grow just 5% in 2005. The unit of measurement is millions of square inches.
"The silicon wafer capacity continued to be in balance with the demand through the first half of 2004 and we foresee continued moderate year-on-year growth that will result in cautious expansion and a tight supply scenario that should lead to an improved financial outlook for the silicon industry," said John Kauffmann, SMG chairman.
Kauffmann said that the SMG concurs with the statement in the July news release from the Japan Society of Newer Metals, which indicates that "the administrative circumstances of the silicon industry are becoming more severe [tight supply]" and "semiconductor manufacturers and silicon manufacturers should further strengthen ties of partnership and cooperate on technology, cost, etc. to settle the existing issues."
Process Rx: Kester Offers Pb-Free Clinic at Mexitronica
October 12— Kester will hold a Lead-free Mini-Clinic at their booth, number 710, during the Mexitrónica Conference and Exhibition in Guadalajara, Mexico, from Oct. 19-21, 2004.
Users and future users of lead-free will have the opportunity to ask industry experts pertinent questions to enable them to achieve lead-free assembly rapidly and efficiently.
Kester will also exhibit a complete line of lead-free products. Kester University ‘s lead-free training program and consultancy services will also be available.
Armando Torres will host the clinic throughout show hours.
The U.S. Department of Defense awarded the nonprofit research group a research contract for the Vertically Interconnected Sensor Arrays (VISA) program. This contract is a collaborative effort between MCNC-RDI and DRS Infrared Technologies.
The program objective is to develop 3-D architectures and circuits that enable massively parallel signal processing for high-resolution IR focal plane arrays for strategic and tactical systems. The 3-D interconnect permits integration of detector arrays with multiple layers of ICs by means of insulated and metallized vias (vertical holes) etched through the body of the IC chips. The resulting multilayer structure offers optimal short interconnect paths and enables significantly higher interlayer bandwidths for more demanding signal processing requirements.
The weeklong Chinese Autumn holiday that ended this week has had a big impact on air freight conditions, says Trans Global Logistics. "Local factories pumped out high volumes of goods before the break and many factories continued to churn out goods during the week, adding to the backlog of cargo at regional transit hubs," the company said in a customer briefing. Transit times will likely grow, Trans Global says, as the cargo buildup is worked ouut.
Regional notes:
- Shanghai carriers have announced a rate increase of 9%, while transit times for deferred service have suffered because of the freight buildup. Export volume is projected to be strong through October.
- Big-project shipping will keep air cargo strong in Hong Kong through November.
- In Taiwan, carriers have announced a third round of peak season increases (10 to 15%), but those levels may not stick because the market is not as strong as expected. Anticipate longer transit times and higher costs for space and fuel, and book large-sized or "hot" shipments as early as possible.
The show will be held Oct. 12-14, in Amsterdam.
Elcoteq's model -- called Virtual Cluster -- is based on a partnership where the OEM focuses design and technology, and Elcoteq handles issues of manufacturability, the manufacturing equipment budget, production capacity, bill of materials, supply chain, and creating and maintaining a time-line and focus for production and delivery to the OEM's customer.
By jointly setting up a process of defined milestones to discuss upcoming products and manufacturing challenges, both companies are prepared for time and manufacturing adjustments, and the engineering department can focus on design instead of logistics, reducing time-to-market, Elcoteq says.
For more on the Virtual Cluster model, see next month's Circuits Assembly.
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