News
AUSTIN, TX -- TechSearch International’s teardown of the Apple Watch Series 6 GPS+LTE examined 108 board-level packages plus another 17 packages inside modules and found 27% more wafer level packages (WLPs) than in the previous Series 5, including packages in the wireless charger. Apple used more multi-die modules in the new watch.
NEW DELHI, INDIA -- The US isn't the only nation placing intense emphasis on its boosting domestic semiconductor industry.
NEEDHAM, MA – The Covid-19 pandemic had a positive impact on the tablet market in 2020 as consumers, businesses, and schools sought tablets to stay connected, entertained, or productive.
BROOKLYN -- Cemtrex reported revenue for the three months ended Mar. 31 was $9.3 million, down 24% from $12.1 million a year ago.
POWAY, CA -- Cohu today announced that it has completed the sale of its Printed Circuit Board Test Group business to Mycronic.
SUNNYVALE, CA -- Google Cloud today launched Visual Inspection AI, a new purpose-built solution to help manufacturers, consumer packaged goods companies, and other businesses worldwide reduce defects and deliver significant operational savings from the manufacturing and inspection process.
Press Releases
- ASMPT and IBM Deepen Collaboration to Advance Bonding Methods for Chiplet Packages for AI
- Murray Percival Company Expands Product Line with Representation of BIMOS ESD Seating in the Midwest
- Selectronic Assembly Welcomes Eliud Herrera as Production Manager
- SP Manufacturing Holds Milestone Anniversary Celebration