News
LYON, FRANCE – FCBGA package revenue is expected to reach $12 billion by 2025, driven by AI, data center and HPC momentum, according to Yole Développement, a CAGR of 3% between 2020 and 2025.
TECATE, MEXICO – VTech Holdings has signed an agreement with QSC to acquire its production facility here to manufacture wood enclosure loudspeakers.
ATLANTA, GA – UP Media Group Inc. today announced new dates for PCB East 2021 when it returns to the Boston area this year.
LONDON – Intel will not abandon manufacturing, despite pressures from investors, according to GlobalData. The firm will, instead, continue its hybrid manufacturing strategy to maintain the advantage of manufacturing on US soil.
NEENAH, WI – Plexus reported fiscal first quarter revenue of $830.4 million, down 2.6% year-over-year and 9.1% sequentially.
MANASSAS, VA – Zestron and GEN3 Systems are collaborating on a new test service in the US to help develop objective evidence required by the latest release of IPC-J-STD-001H.
Press Releases
- SIA Applauds CHIPS Act Incentives for Amkor Facility in Arizona
- ASMPT and IBM Deepen Collaboration to Advance Bonding Methods for Chiplet Packages for AI
- Murray Percival Company Expands Product Line with Representation of BIMOS ESD Seating in the Midwest
- Selectronic Assembly Welcomes Eliud Herrera as Production Manager