HERNDON, VA – iNEMI is hosting an Aug. 30 webinar on its Packaging and Component Substrates Roadmap. Bill Bottomsm, who chaired the committee that wrote the chapter, will lead the webinar.
TAIPEI -- Foxconn today said its planned campus in Wisconsin will house at least three factories for buiding high-end LCD panels.
CHICAGO -- There were 5 EMS transactions in the second quarter, three of which involved consolidations, says an investment advisory group that tracks the industry.
SMYRNA, GA – CIRCUITS ASSEMBLY opened its 2018 New Product Introduction Awards (NPI) for printed circuit board assembly.
DUBLIN -- The global stretchable electronics market is expected to rise at a CAGR of about 105% from 2016 to 2023, a new report asserts.
CAMBRIDGE, UK – The wearable devices market will reach over $150 billion annually by 2027, says IDTechEx Research.