TAIPEI, TAIWAN -- Inventec will expand production capacity in several regions outside China to meet growing demand for IT infrastructure and PC equipment, according to published reports.

ALBUQUERQUE, NM — TE Connectivity and 3D Glass Solutions are collaborating on the development of electronic interconnect devices using glass-based system-in-package (SiP) technology.

SAN JOSE -- SMTC's third quarter sales fell 20% year-over-year to $42.7 million but the company lowered its net loss.

FRAMINGHAM, MA – The worldwide tablet market continued its slump, as vendors shipped 43 million units in the third quarter, a year-over-year decline of 14.7%, according to the International Data Corp. Third quarter shipments were up 9.8% sequentially.