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SAN JOSE -- From toys and games, freshness sensors, body media, and medical devices to applications in outer space and high speed communications, flexible and printed electronics are changing the ways companies develop advanced products and packages to better serve their customers and gain a competitive advantage.  To speed adoption of these technologies into a broad range of industries, FlexTech Alliance today announced the formation of users groups focused on two general application areas: wearable electronics and disposable electronics.

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NORTH READING, MA -- Teradyne and Goepel Electronic have developed an extended boundary scan option for production in-circuit and functional PCB testers  and modular functional testers on VXI and PXI Express.

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TAIPEI -- Foxconn Electronics reported consolidated revenues rose 18% year-over-year to NT$456.2 billion ($15.4 billion) in November. It set a new monthly sales mark for the world's largest ODM/EMS company.

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FRAMINGHAM, MA -- IDC Manufacturing Insights today predicted 3D supply chains will be one of the top developments in the coming year. The research group made its comments as part of its annual top 10 predictions for manufacturing.

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ZURICHCicor Group is merging its Cicor Printed Circuit Boards and Cicor Microelectronics divisions into a single unit: Advanced Microelectronics & Substrates. The move comes after Microelectronics has failed to make significant progress over the past two years, the firm says.

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NOTTINGHAM, UK – The 9th International Conference on Additive Manufacturing and 3D Printing requests abstracts focused on process and materials development, design and software developments, supply chain and management issues, and novel applications of additive manufacturing.

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