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COLLEGE PARK, MDCALCE and IPC will sponsor a technical seminar May 24 and 25 here: JISSO Forum on Reliability of Electronics.

This seminar is intended to provide an interactive forum to discuss the latest concerns, trends and technologies in electronics that impact product reliability.

CALCE, IPC and members of the JISSO International Council will speak on embedded technologies, batteries, environmental regulations, counterfeit avoidance, test and simulation methods, and the emerging field of prognostics.

Attendees will get a snapshot of integrated electronics development and manufacturing, and receive input on technologies that will impact the electronics industry over the next 10 years.

JISSO North America will also host the Annual JISSO International Conference (May 25 – 27) and a standards meetings for the IEC Technical Committee 91 on printed circuit boards (May 23 – 25), both also at the University of Maryland. 

BANNOCKBURN, IL – An estimated one-third of all printed circuit boards for US defense or military systems are produced outside North America, according to recent IPC data.

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TAIPEI -- Foxconn Electronics' (Hon Hai) non-consolidated revenues rose 33.2% year-over-year in April to NT$204.9 billion ($7.2 billion) on growth in consumer electronics.

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PATHUMTHANI, THAILAND -- SVI Public Co., the third largest Thailand-based EMS company, reported first-quarter consolidated net profits rose 32% to 229 million baht ($7.6 million), a record for the quarter.

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RICHARDSON, TX ― Automated Circuit Design has completed a 13,500 sq. ft. expansion to its electronics manufacturing services facility here, the company said.

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OXFORDSHIRE, ENGLAND – The Smart Area Array Reliability Conference and Table Top Exhibition will be held here Oct. 5 and 6.

Topics include industry trends on area array packaging; design and reliability of BGA and uBGA devices; soldering and joint reliability of lead-free and mixed alloys; ductility of lead-free solder balls; underfill vs. corner bumping; pad cratering on laminates; design for cleaning electronics assemblies; no-clean vs. clean; aqueous, semiaqueous and solvent choices; demonstrating area array cleaning reliability; coating and its impact of joint reliability; coating under BGA; and tin whiskers and benefits from coating.

For more information, visit www.smartgroup.org.

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