News
GLENVIEW, IL – Illinois Tool Works today reported an operating revenue increase of 11% for the three months ended Nov. 30 versus the year-ago period.
Organic revenues contributed 9% to total revenue growth in the third quarter. In addition, acquisitions added 3% to top-line growth.
Sales at the company’s Power and Electronics unit were up 22.8%. The segment includes Speedline Technologies, Kester Solder, Vitronics-Soltec and other leading electronics manufacturing suppliers.
The 2010 fourth-quarter forecast assumes a total revenue growth range of 7% to 9%.
For full-year 2010, ITW forecasts a revenue growth range of 13% to 14%.
SCHWANDORF, GERMANY -- EMS firm EN ElectronicNetwork has acquired the manufacturing site of Görmiller Electronic out of insolvency.
No financial terms were disclosed for the deal, which took effect immediately.
The Görmiller site, located in Schwandorf, gives EN ElectronicNetwork its fifth site in Germany.
SAN JOSE – Worldwide semiconductor manufacturing equipment billings reached $11.12 billion in the third quarter, up 22% sequentially.
NORTHBROOK, IL— A new Underwriters Laboratories white paper clarifies the theory of dielectric breakdown and the objective of the dielectric voltage withstand test, which takes place during the product design phase of electronic devices.
CEDAR RAPIDS, IA -- Did avoiding the voids just get less important? A multi-company investigation into BGA voids suggests as much.
SMYRNA, GA – UP Media Group Inc. seeks abstracts for PCB West 2011, to be held September 27-29, 2010, in Santa Clara, CA. The event includes a three-day technical conference and one-day exhibition to be held at the Santa Clara (CA) Convention Center.
PCB West annually provides a conference and exhibition focused on the design and manufacture of PCBs, HDI, electronics assembly and circuit board test.
Papers and presentations of the following durations are sought for the technical conference: one-hour lectures and presentations; two-hour workshops, and half-day (3.5 hour) seminars.
Suggested paper and presentation topics include LED design and assembly; RF and microwave design; high speed, high frequency and signal integrity; component placement; EMI/EMC analysis; thermal analysis; lead-free processes; environmental legislation (REACH, RoHS, etc.) and its effects; packaging design; mixed-signal design; area arrays; FPGA design and implementation; embedded passives and active devices; flexible circuitry; HDI design and technologies; PCB design/layout basics; component library creation and management; design for manufacture, test and assembly; electronics assembly; soldering; component placement; screen and stencil printing; PCB fabrication; surface finishes; industry forecasts, and business and supply chain issues.
Papers and presentations must be noncommercial in nature and should focus on technology, techniques or methodology. Abstracts of 300 words or less should be submitted to conference co-chairs Pete Waddell (pwaddell@upmediagroup.com) or Mike Buetow (mbuetow@upmediagroup.com) by April 29. If selected, final papers and presentations will be due July 8, 2010.
Printed Circuit Design & Fab and CIRCUITS ASSEMBLY magazines are media partners for the event.
For more information about PCB West, visit pcbwest.com or contact Show Manager Alyson Skarbek at 404-665-7749; askarbek@upmediagroup.com.
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