Circuits Assembly Online Magazine - White Papers

News

RONKONKOMA, NY -- API Technologies swung to a fiscal first-quarter net profit of $800,000, up from a loss of $800,000 last year.

WUZHONG, CHINA -- Flextronics opened its latest computing facility here, its fourth in China, as it aims to become a major player in the PC manufacturing business.

SANTA CLARA, CA — 3D TV is now readily available in retail, but the uptake among consumers has been limited by high prices and lack of content.

EL SEGUNDO, CA -- Semiconductor inventory levels may have headed into oversupply territory in the third quarter, according to research firm iSuppli.

ALEXANDRIA, VA -- Six inventors have been issued a US patent for a multilayer electronically isolated thermal conduction structure for a circuit board assembly.

POWAY, CA – A pair of Production Solutions engineers have been awarded a US patent for a universal board support.

The universal board support, which the company markets under the name Red-E-Set VB, is for screen printers with vacuum box tooling. It was issued to Douglas Farlow and Thomas Gordon. The patent number is 7,311,302.

According to the patent filing, the application informs an improved substrate support system for clamping spring loaded pins that support substrates, such as printed circuit boards, which have even profiles and uneven profiles due to components being installed on one side during manufacturing operations to the opposite side of the substrate. The substrate support system can utilize a cam lever, a knob, or a draw latch to move a clamping plate between an aligned position and a clamping position.