News
LAS VEGAS -- Heraeus will cease solder production at its North American manufacturing facilities, CIRCUITS ASSEMBLY has learned.
IPC-A-600H features 95 new and updated photos and illustrations, for a total of 326. The standard offers expanded coverage on topics such as solder mask coverage, etchback, plated-hole wall integrity, via fill, and flexible circuits. It also addresses copper cap-plating of vias and copper-wrap plating.
Criterion for how much a flex circuit can be bent or folded is now available. The document addresses coverlays sometimes used to protect flex circuits.
IPC-6012C addresses determining how many boards and/or test coupons to check. A document used for specifying circuit boards, IPC-6012 details frequency of inspection, instructing how many panels must be examined within a production lot for a given performance class.
Before the completion of the latest revisions, the standards’ next series of enhancements were being planned, including finer geometries, high-density PCBs, the proximity of microvias and stacked microvias that go from one layer to another.
TEMPE, AZ – US manufacturing grew in March for the eighth consecutive month, with the PMI registering 59.6%, up 3.1 percentage points, says the Institute for Supply Management.
CHONGQING, CHINA – Hon Hai Group (Foxconn) will recruit more than 6,000 workers in the next six months here at its new PC manufacturing factory, according to published reports.
The firm also plans to expand the plant`s workforce to some 10,000 by 2011, all to accommodate a forecast annual output of more than 10 million notebook PCs.
The company also is pushing its suppliers to move into Chongqing, in an effort to vertically integrate a PC supply chain there. In the future, 80% of the facility’s bill of materials will be sourced locally, chairman Terry Gou said.
