Carlsbad, CA -- Asymtek, a Nordson Company, received Intel Corp.'s 2004 Supplier Continuous Quality Improvement (SCQI) award. The company was given the award for its efforts in supplying Intel with automated fluid dispensing equipment. The company also won a SCQI award in 2003.
Asymtek and other SCQI award winners were honored at a celebration in Burlingame, CA on March 15. Intel also recognized award winners with an advertisement in the U.S., Europe and Asian editions of the Wall Street Journal.
"Asymtek continues to deliver outstanding results on key programs and initiatives for Intel," said Ron Rinfret, Director of Assembly Capital Equipment Development, Intel. "For the second year in a row Asymtek has been recognized as one of the 'best of the best' suppliers at Intel. We look forward to working with Asymtek in 2005 on additional challenging and strategic initiatives and are confident in their continued excellent support."
The SCQI awards are part of Intel's Supplier Continuous Quality Improvement process, which encourages key suppliers to strive for excellence and continuous improvement.
GREENVILLE, SC -- Kemet Corp. has named electronics veteran Per-Olof Loof chief executive, effective April 4. The company also named a new chairman.
Loof is managing partner of a New York management consulting firm. He was previously chief executive of
Sensormatic Electronics, now part of Tyco. Loof also has had posts at Andersen Consulting, Digital
Equipment Corporation, AT&T and NCR.
SAN JOSE -- Tessera
Technologies today
raised its financial guidance for the first
quarter of 2005. The company also announced a licensing deal with Fujitsu.
Tessera now expects first quarter revenue in the range of
$27.3 million to $27.5 million, as compared to previous guidance of
$21.5 million to $22.0 million.
Ina press release, Tessera chairman and chief executive Bruce
McWilliams said, "We are revising our guidance upwards based upon the
impact of
new licenses signed, as well as the overall good performance from our
existing licensees in the past quarter, particularly related to
devices used in computing and in personal communications."
Also, today, the company signed a technology licensing agreement with
Fujitsu covering chip-scale packaging in ASICs, ASSPs and
system-on-chips.
The technology includes chip-scale and multichip package types. No financial details were disclosed.