North Reading, MA, March 23- Teradyne Inc. has announced a new 3-D x-ray imaging technology for detecting PCB solder and production defects.
Using
a patented off-center tomosynthesis imaging technique, ClearVue is
suited for densely packed single- or double-sided boards that use
BGA-style components, or when loss of electrical or optical access is
problematic.
Compared to laminography and other 3-D
x-ray techniques, the technology reportedly provides superior
image clarity, diagnostic capabilities and full board coverage to
expose solder (including lead-free) flaws that are otherwise
overlooked.
Operates using a stationary x-ray
source and detector and, unlike conventional systems, does not require
complex or rotating mechanical parts. Said to result in lower false
call rates (promising up to 40 times improvement over existing
solutions), improved reliability, better repeatability and improved
cycle times.
FRANKLIN, MA- SMT knowledge experts from Speedline Technologies
will lead a free, one-hour Webcast seminar on April 14 to answer
questions engineers need to consider before implementing lead-free
reflow soldering processes on their manufacturing floor.
The
Webcast, scheduled from 11 a.m. to Noon, EST, will feature live
discussions of process challenges, new technologies, how-to
implementation information and participant questions. Topics
include:
Required equipment and process changes; Details to
consider in optimizing the lead-free process; Reflow equipment
configurations and differences; Producing lead-free assemblies;
Nitrogen process variables; Cooling considerations; Cost of operation.
LOUISVILLE, KY --Sypris
Solutions Inc. today promoted Robert Sanders to president of Sypris
Electronics. Sanders, recently named group vice president of the Electronics Group, replaces James G. Cocke.
Sanders is a former general manager and site executive for
the Defense & Space Electronics Systems division of Honeywell.
Sypris Electronics is a contract desginer and assembler of missile
guidance systems, and gear and satellite communication systems.