MINNEAPOLIS -- CyberOptics promoted Steven DiMarco to vice president and general manager, Inspection Systems Business, responsible for new systems product development and manufacturing center in Singapore as well as global sales and marketing and service. He has been with CyberOptics since 2005, most recently as vice president of sales and marketing.

The business unit produces AOI and solder paste inspection systems. 

HSINCHU, TAIWAN -- Powertech Technology Inc. has licensed IBM's MPS-C2 (Metal Post Solder-Chip Connection) technology, the company said today. No financial terms were disclosed.

MPS-C2 is a ultra fine pitch flip-chip package technology for chips with bond pad pitches of less than 80 microns.
It is useful in such applications as cell phones and other mobile applications where conventional wire-bond PoP, PiP or SiP packages might not work.

MPS-C2 is used to make bumps on pads with copper posts and SnAg solder. The bumps are formed on aluminum pads through a wafer plating process without redistribution. The bumps can then be connected to an organic substrate’s copper pads using conventional SMT reflow.

PTI is now the leading memory ODM package and testing house in the world.  

BRUSSELS – The European Commission has approved Foxconn’s purchase of two Sanmina-SCI plants.
 
The agreement covers plants located in Szekesfehervar, Hungary, and Guadalajara, Mexico, which perform EMS and repair services.
 
The deal is said to be worth between $80 million and $90 million, Sanmina said, according to published reports.
 
In a statement, the EC wrote, “After examining the operation, the Commission concluded that the transaction would not significantly impede effective competition in the European Economic Area (EEA) or any substantial part of it.”
 
The deal is expected to be final by the end of June.