A group of providers of lead-free soldering and assembly will put on a full day of seminar presentations at the Hilton Hotel, Nuremberg, Germany on June16, 2004. The event has been planned close to the nearby SMT Exhibition to allow manufacturing management the opportunity to attend both events.

 

A representative from Indium Corp. (Utica, NY) and Vahid Goudarzi of Motorola will explain how Motorola implemented lead-free solder in the production of over 10 million cellular phones. The discussion will also cover initial quality and product implementation.

 

Dr. Ning Cheng Lee and Dr. Ronald Lasky of Indium will also cover topics such as alloy selection and challenges and best practices of implementing lead-free assembly.

 

A number of other presentations include Hewlett Packard's discussion on implementation onto large boards. Gerjan Diepstraten, Vitronics- Soltec, will discuss lead-free wave soldering and Hans-Juergen Albrecht, Siemens, will cover reliability of lead-free interconnects. Ross Bernston, Indium, will cover the subject of mixed technology in lead-free assembly.

 

ACB, Peters and KIC will give other presentations. The event is by reservation only.

 

www.indium.com/quickstart

 

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Ray Prasad Consultancy has announced that a detailed lead-free course will take place on May 17-18, 2004, in Beaverton, OR, presented by Ray Prasad and Dr. Raiyo Aspandiar of Intel.

 

The course, Lead Free Technology For Electronic Assemblies: Problems and Promises, is led by instructors that have years of hands-on experience in implementing surface-mount and lead free in small and large companies to help identify business and technical issues in lead-free conversion. This is not a theoretical course. Actual Intel case studies will show the pitfalls and successes of lead-free implementation.  

 

In addition to discussing the details of in-house lead free implementation, the course will also show you the questions to should ask your contract manufacturer (CM) if you plan to outsource/off-shore your product. Technical details, including wave and reflow profile development, paste selection, inspection and rework using both conventional and diode laser of lead-free solder joints, will be presented. The course will also give the status of legislation banning lead around the world including Europe, Japan, China and the U.S., and how participants can improve their company's profile and benefit from this disruptive technology. 

 

Engineers and Managers who are either already into lead free or thinking of getting into lead free will benefit from this course. Participants will get an insight into the details of lead-free soldering technology to successfully implement lead free in your process and products.

 

Prasad will also offer a course on Surface-Mount Technology and Ball Grid Array (BGA) Design and Manufacturing on May 11-14, 2004.

 

www.rayprasad.com/coursedescs/intensive.html

 

www.rayprasad.com/course_link.html

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phoenix|x-ray Systems + Services Inc. (Camarillo, CA) has introduced beryllium-free targets in all x-ray systems with open tubes. The new targets build on the company's commitment to produce an environmentally safe line of open tube x-ray systems. The new targets eliminate the potential harmful residual effect that can react from x-ray exposure to a beryllium target, resulting in possible operator exposure due to stress of long-term target exposure and or breakage.

 

The beryllium-free targets provide an advantage to boards and components that have a concern for over exposure and irradiation—such as hi-reel products—because new material used in the targets act as a filter to absorb a portion of the x-ray and minimize potential damages to samples. Combined with the company's low-dose|mode process that only exposes samples for the time that is obligatory to achieve a proper image, test samples will not receive any additional radiation than necessary to complete the inspection. This process and use of a beryllium-free target makes it easy to ensure the trace exposure to various radiations are lessened to ensure long-life operation.

 

As in space, the applications are on the extremes and require concern for operations in a variety of severe conditions and environments. Since the exposures are cumulative, production, test and inspection of the components and boards must take into consideration all aspects of this exposure during the manufacturing process.

 

phoenix|x-ray Systems + Services Inc. is the North American sales, service and applications engineering subsidiary of the Germany-based microfocus x-ray system manufacturer, phoenix|x-ray Systems + Services GmbH. This group of companies offers sealed tube and open tube microfocus/nanofocus x-ray systems dedicated to printed circuit board (PCB) assembly, back-end and multilayer inspection applications.

 

www.phoenix-xray.com

 

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