caLogo

News

SAN JOSE -- Advanced IC packaging technologies such as wafer-level packages, stacked packages and system-in-package have moved into the mainstream of IC production, reports Electronic Trend Publications. Read more ...

LYON, FRANCE -- Wafer-level-package use will exceed 10 billion units per year by 2012, a compound annual growth rate of more than 20% over the next five years.

Read more ...

SMYRNA, GA – Registration is now open for PCB Atlanta, the industry’s leading regional PCB show in the Southeastern US.

PCB Atlanta will be held Oct. 22 at the Atlanta Marriott Alpharetta, in Alpharetta, GA.

The conference includes a two-track technical program featuring speakers from Plexus, Circuit Connect, Endicott Interconnect Technologies, Clover Electronics, Intercept Technology and others.

Topics include circuit board design to fabrication to assembly, and cover such subjects as counterfeit components, design reuse, cleaning flux residues under the z-axis, and vertical integration strategies.

PCB Atlanta exhibits will be open from 11 am - 6 pm. Free technical sessions will be held beginning at 9 am.

For more information, visit www.pcbshows.com/atlanta

Page 3361 of 5068

Don't have an account yet? Register Now!

Sign in to your account